Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PMPB55ENEA

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMPB55ENEASOT1220DFN2020MD-67.484187 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340686221154126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.05600080.0000000.748244
PolymerAcrylic resinProprietary0.01400020.0000000.187061
subTotal0.070000100.0000000.935305
DieDoped siliconSilicon (Si)7440-21-30.470000100.0000006.279907
subTotal0.470000100.0000006.279907
Lead FrameCopper alloyCopper (Cu)7440-50-82.70491393.59560036.141706
Magnesium (Mg)7439-95-40.0042170.1459000.056339
Nickel (Ni)7440-02-00.0843532.9188001.127087
Silicon (Si)7440-21-30.0182760.6324000.244200
Pure metal layerGold (Au)7440-57-50.0009620.0333000.012859
Nickel (Ni)7440-02-00.0740132.5610000.988924
Palladium (Pd)7440-05-30.0032660.1130000.043635
subTotal2.890000100.00000038.614749
Mould CompoundFillerSilica -amorphous-7631-86-90.85790023.00000011.462835
Silica fused60676-86-02.23800060.00000029.903048
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-20.1119003.0000001.495152
Ion trapping agentBismuth (Bi)7440-69-90.0186500.5000000.249192
PigmentCarbon black1333-86-40.0186500.5000000.249192
PolymerEpoxy resin systemProprietary0.2611007.0000003.488689
Phenolic resinProprietary0.2238006.0000002.990305
subTotal3.730000100.00000049.838413
Post-PlatingImpurityLead (Pb)7439-92-10.0000080.0045000.000102
Non hazardousProprietary0.0000940.0555000.001261
Tin solderTin (Sn)7440-31-50.16989899.9400002.270093
subTotal0.170000100.0000002.271456
WireImpurityNon hazardousProprietary0.0000080.0100000.000103
Pure metalCopper (Cu)7440-50-80.07717999.9900001.031231
subTotal0.077187100.0000001.031334
WireImpurityNon hazardousProprietary0.0000080.0100000.000103
Pure metalCopper (Cu)7440-50-80.07699299.9900001.028733
subTotal0.077000100.0000001.028836
total7.484187100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.