Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PSMN5R0-30YL

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PSMN5R0-30YLSOT669LFPAK90.83000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340630751158126030 s126020 s3Leaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-31.40000100.000001.54134
subTotal1.40000100.000001.54134
ClipCopper alloyCopper (Cu)7440-50-819.9735299.8676221.99001
Iron (Fe)7439-89-60.019980.099910.02200
Phosphorus (P)7723-14-00.006490.032470.00715
subTotal20.00000100.0000022.01916
Lead FrameCopper alloyCopper (Cu)7440-50-837.8379799.8100041.65801
Iron (Fe)7439-89-60.056860.150000.06261
Phosphorus (P)7723-14-00.015160.040000.01669
subTotal37.91000100.0000041.73731
Mould CompoundFillerSilica fused60676-86-013.7433061.0000015.13079
Flame retardantZinc Borate138265-88-02.2530010.000002.48046
PigmentCarbon black1333-86-40.067590.300000.07441
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-24.4384119.700004.88650
Phenolic resinProprietary2.027709.000002.23241
subTotal22.53000100.0000024.80457
Post-PlatingImpurityNon hazardousProprietary0.000380.010000.00042
Tin alloyTin (Sn)7440-31-53.8496299.990004.23826
subTotal3.85000100.000004.23868
Solder PasteLead alloyLead (Pb)7439-92-14.7545092.500005.23450
Silver (Ag)7440-22-40.128502.500000.14147
Tin (Sn)7440-31-50.257005.000000.28295
subTotal5.14000100.000005.65892
total90.83000100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.