Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PSMN6R0-30YL

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PSMN6R0-30YLSOT669LFPAK90.73000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340630761158126030 s126020 s3Leaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-31.30000100.000001.43282
subTotal1.30000100.000001.43282
ClipCopper alloyCopper (Cu)7440-50-819.9735299.8676222.01424
Iron (Fe)7439-89-60.019980.099910.02202
Phosphorus (P)7723-14-00.006490.032470.00716
subTotal20.00000100.0000022.04342
Lead FrameCopper alloyCopper (Cu)7440-50-837.8379799.8100041.70392
Iron (Fe)7439-89-60.056860.150000.06267
Phosphorus (P)7723-14-00.015160.040000.01671
subTotal37.91000100.0000041.78330
Mould CompoundFillerSilica fused60676-86-013.7433061.0000015.14747
Flame retardantZinc Borate138265-88-02.2530010.000002.48319
PigmentCarbon black1333-86-40.067590.300000.07450
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-24.4384119.700004.89189
Phenolic resinProprietary2.027709.000002.23487
subTotal22.53000100.0000024.83192
Post-PlatingImpurityNon hazardousProprietary0.000380.010000.00042
Tin alloyTin (Sn)7440-31-53.8496299.990004.24294
subTotal3.85000100.000004.24336
Solder PasteLead alloyLead (Pb)7439-92-14.7545092.500005.24027
Silver (Ag)7440-22-40.128502.500000.14163
Tin (Sn)7440-31-50.257005.000000.28326
subTotal5.14000100.000005.66516
total90.73000100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.