Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PZU84-B24-Q

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PZU84-B24-QSOT23TO-236AB7.666837 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934666724215212601235
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.050000100.0000000.652159
subTotal0.050000100.0000000.652159
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.0022940.0900000.029922
Carbon (C)7440-44-00.0010200.0400000.013299
Chromium (Cr)7440-47-30.0056080.2200000.073144
Cobalt (Co)7440-48-40.0109610.4300000.142962
Iron (Fe)7439-89-61.22301047.98000015.951953
Manganese (Mn)7439-96-50.0219210.8600000.285925
Nickel (Ni)7440-02-00.92120936.14000012.015497
Phosphorus (P)7723-14-00.0005100.0200000.006649
Silicon (Si)7440-21-30.0066270.2600000.086442
Sulphur (S)7704-34-90.0005100.0200000.006649
Pure metal layerCopper (Cu)7440-50-80.28982111.3700003.780194
Silver (Ag)7440-22-40.0655092.5700000.854450
subTotal2.549000100.00000033.247087
Mould CompoundAdditiveNon hazardousProprietary0.1414912.9000001.845494
Triphenylphosphine603-35-00.0024400.0500000.031819
FillerSilica -amorphous-7631-86-93.51288072.00000045.819156
PigmentCarbon black1333-86-40.0024400.0500000.031819
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.73185015.0000009.545657
Phenol Formaldehyde resin (generic)9003-35-40.48790010.0000006.363772
subTotal4.879000100.00000063.637717
Post-PlatingImpurityLead (Pb)7439-92-10.0000080.0045000.000109
Non hazardousProprietary0.0001030.0555000.001339
Tin solderTin (Sn)7440-31-50.18488999.9400002.411542
subTotal0.185000100.0000002.412990
WirePure metalCopper (Cu)7440-50-80.003837100.0000000.050043
subTotal0.003837100.0000000.050043
total7.666837100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.