Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content XS3A1T5157GM

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
XS3A1T5157GMSOT886XSON62.019026 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9356909711155126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.151561100.0000007.506623
subTotal0.151561100.0000007.506623
ComponentAdditiveNon hazardousProprietary0.0002505.0000000.012382
FillerBisphenol A-epichlorohydrin resin25068-38-60.0002505.0000000.012382
Silica -amorphous-7631-86-90.00250050.0000000.123822
PolymerEpoxy resin systemProprietary0.00150030.0000000.074293
Phenol Formaldehyde resin (generic)9003-35-40.00050010.0000000.024764
subTotal0.005000100.0000000.247644
Lead FrameCopper alloyCopper (Cu)7440-50-80.72961794.51000036.137088
Magnesium (Mg)7439-95-40.0011580.1500000.057354
Nickel (Ni)7440-02-00.0227742.9500001.127970
Silicon (Si)7440-21-30.0049410.6400000.244712
Pure metal layerGold (Au)7440-57-50.0001540.0200000.007647
Nickel (Ni)7440-02-00.0126611.6400000.627075
Palladium (Pd)7440-05-30.0006950.0900000.034413
subTotal0.772000100.00000038.236258
Mould CompoundAdditiveNon hazardousProprietary0.0043710.4100000.216471
FillerSilica -amorphous-7631-86-90.0030910.2900000.153113
Silica fused60676-86-00.91835986.15000045.485249
HardenerPhenolic resinProprietary0.0457314.2900002.265023
PigmentCarbon black1333-86-40.0020250.1900000.100316
PolymerEpoxy resin systemProprietary0.0924228.6700004.577564
subTotal1.066000100.00000052.797735
WireGold alloyGold (Au)7440-57-50.02422099.0000001.199606
Palladium (Pd)7440-05-30.0002451.0000000.012117
subTotal0.024465100.0000001.211723
total2.019026100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.