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Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

NXS0101

Dual supply translating transceiver; open drain; auto direction sensing

The NXS0101 is a 1-bit, dual supply translating transceiver with auto direction sensing, that enables bidirectional voltage level translation. It features one 1-bit input-output port (A and B), one output enable input (OE) and two supply pins (VCC(A) and VCC(B)). VCC(A) can be supplied at any voltage between 1.65 V and 3.6 V and VCC(B) can be supplied at any voltage between 2.3 V and 5.5 V, making the device suitable for translating between any of the voltage nodes (1.8 V, 2.5 V, 3.3 V and 5.0 V). Pins A and OE are referenced to VCC(A) and pin B is referenced to VCC(B). A LOW level at pin OE causes the output to assume a high-impedance OFF-state. This device is fully specified for partial power-down applications using IOFF. The IOFF circuitry disables the output, preventing the damaging backflow current through the device when it is powered down.

Features and benefits

  • Wide supply voltage range:

    • VCC(A): 1.65 V to 3.6 V and VCC(B): 2.3 V to 5.5 V

  • Maximum data rates:

    • Push-pull: 24 Mbps

  • IOFF circuitry provides partial Power-down mode operation

  • Inputs accept voltages up to 5.5 V

  • ESD protection:

    • HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2500 V for A port

    • HBM: ANSI/ESDA/JEDEC JS-001 class 3B exceeds 8000 V for B port

    • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1500 V

  • Latch-up performance exceeds 100 mA per JESD 78B Class II

  • Multiple package options

  • Specified from -40 °C to +85 °C and -40 °C to +125 °C

Applications

  • Desktop PC

  • Handset

  • Smartphone

  • Tablet

Parametrics

Type number VCC(A) (V) VCC(B) (V) Logic switching levels Output drive capability (mA) tpd (ns) Nr of bits Power dissipation considerations Tamb (°C) Package name
NXS0101GM 1.65 - 3.6 2.3 - 5.5 CMOS - 0.02 / 1.0 4.7 1 low -40~125 XSON6
NXS0101GS 1.65 - 3.6 2.3 - 5.5 CMOS - 0.02 / 1.0 4.7 1 low -40~125 XSON6
NXS0101GW 1.65 - 3.6 2.3 - 5.5 CMOS - 0.02 / 1.0 4.7 1 low -40~125 TSSOP6

Package

Type number Orderable part number, (Ordering code (12NC)) Status Marking Package Package information Reflow-/Wave soldering Packing
NXS0101GM NXS0101GMX
(935289722115)		 Active m1 SOT886
XSON6
(SOT886) 		SOT886 REFLOW_BG-BD-1
SOT886_115
NXS0101GS NXS0101GSH
(935690898125)		 Active m1 SOT1202
XSON6
(SOT1202) 		SOT1202 REFLOW_BG-BD-1
Not available
NXS0101GW NXS0101GWH
(935289724125)		 Active m1 SOT363-2
TSSOP6
(SOT363-2) 		SOT363-2 SOT363-2_125

Environmental information

Type number Orderable part number Chemical content RoHS RHF-indicator
NXS0101GM NXS0101GMX NXS0101GM rohs rhf rhf
NXS0101GS NXS0101GSH NXS0101GS rohs rhf rhf
NXS0101GW NXS0101GWH NXS0101GW rohs rhf rhf
Quality and reliability disclaimer

Documentation (16)

File name Title Type Date
NXS0101_Q100 Dual supply translating transceiver; open drain; auto direction sensing Data sheet 2023-11-16
NXS0101 Dual supply translating transceiver; open drain; auto direction sensing Data sheet 2023-11-16
Nexperia_document_guide_MiniLogic_MicroPak_201808 MicroPak leadless logic portfolio guide Brochure 2018-09-03
SOT886 3D model for products with SOT886 package Design support 2019-10-03
SOT1202 3D model for products with SOT1202 package Design support 2023-02-02
SOT363-2 3D model for products with SOT363-2 package Design support 2023-02-02
nxs0101 NXS0101 IBIS model IBIS model 2020-11-05
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
DFN1410-6_SOT886_mk plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body Marcom graphics 2017-01-28
XSON6_SOT886_mk plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body Marcom graphics 2017-01-28
SOT886 plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body Package information 2022-06-01
SOT1202 plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm body Package information 2022-06-01
SOT363-2 plastic thin shrink small outline package; 6 leads; body width 1.25 mm Package information 2022-11-21
REFLOW_BG-BD-1 Reflow soldering profile Reflow soldering 2021-04-06
MAR_SOT886 MAR_SOT886 Topmark Top marking 2013-06-03
MAR_SOT1202 MAR_SOT1202 Topmark Top marking 2013-06-03

Support

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Models

File name Title Type Date
SOT886 3D model for products with SOT886 package Design support 2019-10-03
SOT1202 3D model for products with SOT1202 package Design support 2023-02-02
SOT363-2 3D model for products with SOT363-2 package Design support 2023-02-02
nxs0101 NXS0101 IBIS model IBIS model 2020-11-05

Ordering, pricing & availability

Sample

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