Package information
| Package information | Package name | Package description | Reference | Date |
|---|---|---|---|---|
| OL-IP4369CX4 | WLCSP4 | wafer level chip-size package; 4 bumps (2 x 2); 0.4 mm pitch; 0.76 mm x 0.76 mm x 0.47 mm body | 2007-05-25 |
Related documents
| File name | Title | Type | Date |
|---|---|---|---|
| OL-IP4369CX4 | 3D model for products with OL-IP4369CX4 package | Design support | 2023-03-13 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| OL-IP4369CX4 | wafer level chip-size package; 4 bumps (2 x 2); 0.4 mm pitch; 0.76 mm x 0.76 mm x 0.47 mm body | Package information | 2020-04-21 |
Products in this package
ESD protection, TVS, filtering and signal conditioning
| Type number | Description | Quick access |
|---|---|---|
| IP4369CX4 | ESD protection for high-speed interfaces |