Package information
Package information | Package name | Package description | Reference | Date |
---|---|---|---|---|
OL-PCMF3HDMI2BA-C | WLCSP15 | wafer level chip-size package; 15 bumps (6-3-6) | 2020-05-06 |
Related documents
File name | Title | Type | Date |
---|---|---|---|
OL-PCMF3HDMI2BA-C | 3D model for products with OL-PCMF3HDMI2BA-C package | Design support | 2023-03-13 |
RS3303_WLCSP15 | RS3303_WLCSP15 | Marcom graphics | 2021-03-11 |
OL-PCMF3HDMI2BA-C | wafer level chip-size package; 15 bumps (6-3-6) | Package information | 2022-01-04 |
Products in this package
ESD protection, TVS, filtering and signal conditioning
Type number | Description | Quick access |
---|---|---|
PCMF3HDMI2BA-C | Common-mode EMI filter for differential channels with integrated bidirectional ESD protection |