Package information
| Package information | Package name | Package description | Reference | Date |
|---|---|---|---|---|
| SOT1089 | XSON8 | plastic, leadless extremely thin small outline package; 8 terminals; 0.35 mm pitch; 1.35 mm x 1 mm x 0.5 mm body | MO-252 (JEDEC) | 2010-04-12 |
Related documents
| File name | Title | Type | Date |
|---|---|---|---|
| Nexperia_document_guide_MiniLogic_MicroPak_201808 | MicroPak leadless logic portfolio guide | Brochure | 2018-09-03 |
| SOT1089 | 3D model for products with SOT1089 package | Design support | 2019-10-07 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| XSON8_SOT1089_mk | plastic, extremely thin small outline package; no leads; 8 terminals; 0.55 mm pitch; 1.35 mm x 1 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
| SOT1089 | plastic, leadless extremely thin small outline package; 8 terminals; 0.35 mm pitch; 1.35 mm x 1 mm x 0.5 mm body | Package information | 2022-06-03 |
| SOT1089_115 | XSON8; Reel pack for SMD, 7''; Q1/T1 product orientation | Packing information | 2020-04-21 |
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
| MAR_SOT1089 | MAR_SOT1089 Topmark | Top marking | 2013-06-03 |
Products in this package
Analog & Logic ICs
| Type number | Description | Quick access |
|---|