Package information
| Package information | Package name | Package description | Reference | Date |
|---|---|---|---|---|
| SOT8057-1 | WLCSP9 | wafer level chip-scale pakage; 9 bumps; 0.92 × 0.92 × 0.42 mm body | 2023-06-01 |
Related documents
| File name | Title | Type | Date |
|---|---|---|---|
| SOT8057-1 | wafer level chip-scale pakage; 9 bumps; 0.92 × 0.92 × 0.42 mm body | Package information | 2023-06-13 |
| SOT8057-1_336 | WLCSP9; Reel dry pack for SMD, 7"; Q1/T1 product orientation | Packing information | 2023-08-10 |
Products in this package
Analog & Logic ICs
| Type number | Description | Quick access |
|---|---|---|
| NXT4556AUR | SIM card interface level translator |