74AUP1G0832
Parametrics
Type number | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Package name |
---|---|---|---|---|---|---|---|---|---|
74AUP1G0832GM | 0.8 - 3.6 | CMOS | ± 1.9 | 6.7 | 70 | 1 | ultra low | -40~125 | XSON6 |
74AUP1G0832GN | 0.8 - 3.6 | CMOS | ± 1.9 | 6.7 | 70 | 1 | ultra low | -40~125 | XSON6 |
74AUP1G0832GS | 0.8 - 3.6 | CMOS | ± 1.9 | 6.7 | 70 | 1 | ultra low | -40~125 | XSON6 |
74AUP1G0832GW | 0.8 - 3.6 | CMOS | ± 1.9 | 6.7 | 70 | 1 | ultra low | -40~125 | TSSOP6 |
Package
Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
---|---|---|---|---|---|---|---|
74AUP1G0832GM | 74AUP1G0832GM,115 (935280619115) |
Active | aY |
XSON6 (SOT886) |
SOT886 |
REFLOW_BG-BD-1
|
SOT886_115 |
74AUP1G0832GM,132 (935280619132) |
Active | aY | SOT886_132 | ||||
74AUP1G0832GN | 74AUP1G0832GN,132 (935291717132) |
Active | aY |
XSON6 (SOT1115) |
SOT1115 |
REFLOW_BG-BD-1
|
SOT1115_132 |
74AUP1G0832GS | 74AUP1G0832GS,132 (935292832132) |
Active | aY |
XSON6 (SOT1202) |
SOT1202 |
REFLOW_BG-BD-1
|
SOT1202_132 |
74AUP1G0832GW | 74AUP1G0832GW,125 (935280618125) |
Active | aY |
TSSOP6 (SOT363-2) |
SOT363-2 | SOT363-2_125 |
All type numbers in the table below are discontinued.
Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
---|---|---|---|---|---|---|---|
74AUP1G0832GF | 74AUP1G0832GF,132 (935281326132) |
Obsolete |
XSON6 (SOT891) |
SOT891 |
REFLOW_BG-BD-1
|
SOT891_132 |
Environmental information
Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
---|---|---|---|---|
74AUP1G0832GM | 74AUP1G0832GM,115 | 74AUP1G0832GM | ||
74AUP1G0832GM | 74AUP1G0832GM,132 | 74AUP1G0832GM | ||
74AUP1G0832GN | 74AUP1G0832GN,132 | 74AUP1G0832GN | ||
74AUP1G0832GS | 74AUP1G0832GS,132 | 74AUP1G0832GS | ||
74AUP1G0832GW | 74AUP1G0832GW,125 | 74AUP1G0832GW |
All type numbers in the table below are discontinued.
Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
---|---|---|---|---|
74AUP1G0832GF | 74AUP1G0832GF,132 | 74AUP1G0832GF |
Documentation (28)
File name | Title | Type | Date |
---|---|---|---|
74AUP1G0832 | Low-power 3-input AND-OR gate | Data sheet | 2023-07-13 |
AN10161 | PicoGate Logic footprints | Application note | 2002-10-29 |
AN11052 | Pin FMEA for AUP family | Application note | 2019-01-09 |
Nexperia_document_guide_MiniLogic_MicroPak_201808 | MicroPak leadless logic portfolio guide | Brochure | 2018-09-03 |
SOT891 | 3D model for products with SOT891 package | Design support | 2019-10-03 |
SOT886 | 3D model for products with SOT886 package | Design support | 2019-10-03 |
SOT1115 | 3D model for products with SOT1115 package | Design support | 2023-02-02 |
SOT1202 | 3D model for products with SOT1202 package | Design support | 2023-02-02 |
SOT363-2 | 3D model for products with SOT363-2 package | Design support | 2023-02-02 |
aup1g0832 | aup1g0832 IBIS model | IBIS model | 2014-12-21 |
Nexperia_document_Logic_CombinationLogic_infocard_201710 | Combination logic solutions card | Leaflet | 2019-08-09 |
Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904 | Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904 | Leaflet | 2019-04-12 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
DFN1010-6_SOT891_mk | plastic, extremely thin small outline package; 6 terminals; 0.55 mm pitch; 1 mm x 1 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
DFN1410-6_SOT886_mk | plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
XSON6_SOT886_mk | plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
XSON6_SOT1115_mk | plastic, extremely thin small outline package; 6 terminals; 0.55 mm pitch; 0.9 mm x 1 mm x 0.35 mm body | Marcom graphics | 2017-01-28 |
SOT891 | plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1 mm x 0.5 mm body | Package information | 2020-04-21 |
SOT886 | plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Package information | 2022-06-01 |
SOT1115 | plastic, leadless extremely thin small outline package; 6 terminals; 0.3 mm pitch; 0.9 mm x 1 mm x 0.35 mm body | Package information | 2022-05-27 |
SOT1202 | plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm body | Package information | 2022-06-01 |
SOT363-2 | plastic thin shrink small outline package; 6 leads; body width 1.25 mm | Package information | 2022-11-21 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
MAR_SOT891 | MAR_SOT891 Topmark | Top marking | 2013-06-03 |
MAR_SOT886 | MAR_SOT886 Topmark | Top marking | 2013-06-03 |
MAR_SOT1115 | MAR_SOT1115 Topmark | Top marking | 2013-06-03 |
MAR_SOT1202 | MAR_SOT1202 Topmark | Top marking | 2013-06-03 |
Support
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Models
File name | Title | Type | Date |
---|---|---|---|
SOT891 | 3D model for products with SOT891 package | Design support | 2019-10-03 |
SOT886 | 3D model for products with SOT886 package | Design support | 2019-10-03 |
SOT1115 | 3D model for products with SOT1115 package | Design support | 2023-02-02 |
SOT1202 | 3D model for products with SOT1202 package | Design support | 2023-02-02 |
SOT363-2 | 3D model for products with SOT363-2 package | Design support | 2023-02-02 |
aup1g0832 | aup1g0832 IBIS model | IBIS model | 2014-12-21 |
Ordering, pricing & availability
Sample
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