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Automotive qualified products (AEC-Q100/Q101)

74AUP1G0832

Low-power 3-input AND-OR gate

The 74AUP1G0832 is a single 3-input AND-OR gate. Schmitt-trigger action at all inputs makes the circuit tolerant of slower input rise and fall times. This device ensures very low static and dynamic power consumption across the entire VCC range from 0.8 V to 3.6 V. This device is fully specified for partial power down applications using IOFF. The IOFF circuitry disables the output, preventing the potentially damaging backflow current through the device when it is powered down.

Features and benefits

  • Wide supply voltage range from 0.8 V to 3.6 V

  • CMOS low power dissipation

  • High noise immunity

  • Overvoltage tolerant inputs to 3.6 V

  • Low noise overshoot and undershoot < 10 % of VCC

  • IOFF circuitry provides partial Power-down mode operation

  • Latch-up performance exceeds 100 mA per JESD 78 Class II Level B

  • Low static power consumption; ICC = 0.9 μA (maximum)

  • Complies with JEDEC standards:

    • JESD8-12 (0.8 V to 1.3 V)

    • JESD8-11 (0.9 V to 1.65 V)

    • JESD8-7 (1.2 V to 1.95 V)

    • JESD8-5 (1.8 V to 2.7 V)

    • JESD8-B (2.7 V to 3.6 V)

  • ESD protection:

    • HBM: ANSI/ESDA/JEDEC JS-001 class 3A exceeds 5000 V

    • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

  • Multiple package options

  • Specified from -40 °C to +85 °C and -40 °C to +125 °C

Parametrics

Type number VCC (V) Logic switching levels Output drive capability (mA) tpd (ns) fmax (MHz) Nr of bits Power dissipation considerations Tamb (°C) Package name
74AUP1G0832GM 0.8 - 3.6 CMOS ± 1.9 6.7 70 1 ultra low -40~125 XSON6
74AUP1G0832GN 0.8 - 3.6 CMOS ± 1.9 6.7 70 1 ultra low -40~125 XSON6
74AUP1G0832GS 0.8 - 3.6 CMOS ± 1.9 6.7 70 1 ultra low -40~125 XSON6
74AUP1G0832GW 0.8 - 3.6 CMOS ± 1.9 6.7 70 1 ultra low -40~125 TSSOP6

Package

Type number Orderable part number, (Ordering code (12NC)) Status Marking Package Package information Reflow-/Wave soldering Packing
74AUP1G0832GM 74AUP1G0832GM,115
(935280619115)
Active aY SOT886
XSON6
(SOT886)
SOT886 REFLOW_BG-BD-1
SOT886_115
74AUP1G0832GM,132
(935280619132)
Active aY SOT886_132
74AUP1G0832GN 74AUP1G0832GN,132
(935291717132)
Active aY SOT1115
XSON6
(SOT1115)
SOT1115 REFLOW_BG-BD-1
SOT1115_132
74AUP1G0832GS 74AUP1G0832GS,132
(935292832132)
Active aY SOT1202
XSON6
(SOT1202)
SOT1202 REFLOW_BG-BD-1
SOT1202_132
74AUP1G0832GW 74AUP1G0832GW,125
(935280618125)
Active aY SOT363-2
TSSOP6
(SOT363-2)
SOT363-2 SOT363-2_125

Environmental information

Type number Orderable part number Chemical content RoHS RHF-indicator
74AUP1G0832GM 74AUP1G0832GM,115 74AUP1G0832GM rohs rhf rhf
74AUP1G0832GM 74AUP1G0832GM,132 74AUP1G0832GM rohs rhf rhf
74AUP1G0832GN 74AUP1G0832GN,132 74AUP1G0832GN rohs rhf rhf
74AUP1G0832GS 74AUP1G0832GS,132 74AUP1G0832GS rohs rhf rhf
74AUP1G0832GW 74AUP1G0832GW,125 74AUP1G0832GW rohs rhf rhf
Quality and reliability disclaimer

Documentation (24)

File name Title Type Date
74AUP1G0832 Low-power 3-input AND-OR gate Data sheet 2023-07-13
AN10161 PicoGate Logic footprints Application note 2002-10-29
AN11052 Pin FMEA for AUP family Application note 2019-01-09
Nexperia_document_guide_MiniLogic_MicroPak_201808 MicroPak leadless logic portfolio guide Brochure 2018-09-03
SOT886 3D model for products with SOT886 package Design support 2019-10-03
SOT1115 3D model for products with SOT1115 package Design support 2023-02-02
SOT1202 3D model for products with SOT1202 package Design support 2023-02-02
SOT363-2 3D model for products with SOT363-2 package Design support 2023-02-02
aup1g0832 aup1g0832 IBIS model IBIS model 2014-12-21
Nexperia_document_Logic_CombinationLogic_infocard_201710 Combination logic solutions card Leaflet 2019-08-09
Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904 Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904 Leaflet 2019-04-12
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
DFN1410-6_SOT886_mk plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body Marcom graphics 2017-01-28
XSON6_SOT886_mk plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body Marcom graphics 2017-01-28
XSON6_SOT1115_mk plastic, extremely thin small outline package; 6 terminals; 0.55 mm pitch; 0.9 mm x 1 mm x 0.35 mm body Marcom graphics 2017-01-28
SOT886 plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body Package information 2022-06-01
SOT1115 plastic, leadless extremely thin small outline package; 6 terminals; 0.3 mm pitch; 0.9 mm x 1 mm x 0.35 mm body Package information 2022-05-27
SOT1202 plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm body Package information 2022-06-01
SOT363-2 plastic thin shrink small outline package; 6 leads; body width 1.25 mm Package information 2022-11-21
REFLOW_BG-BD-1 Reflow soldering profile Reflow soldering 2021-04-06
Nexperia_Selection_guide_2023 Nexperia Selection Guide 2023 Selection guide 2023-05-10
MAR_SOT886 MAR_SOT886 Topmark Top marking 2013-06-03
MAR_SOT1115 MAR_SOT1115 Topmark Top marking 2013-06-03
MAR_SOT1202 MAR_SOT1202 Topmark Top marking 2013-06-03

Support

If you are in need of design/technical support, let us know and fill in the answer form we'll get back to you shortly.

Models

File name Title Type Date
SOT886 3D model for products with SOT886 package Design support 2019-10-03
SOT1115 3D model for products with SOT1115 package Design support 2023-02-02
SOT1202 3D model for products with SOT1202 package Design support 2023-02-02
SOT363-2 3D model for products with SOT363-2 package Design support 2023-02-02
aup1g0832 aup1g0832 IBIS model IBIS model 2014-12-21

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