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74LVC574A-Q100
Parametrics
Type number | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | fmax (MHz) | Power dissipation considerations | Tamb (°C) | Package name |
---|---|---|---|---|---|---|---|---|
74LVC574ABQ-Q100 | 1.2 - 3.6 | CMOS/LVTTL | ± 24 | 3.2 | 150 | low | -40~125 | DHVQFN20 |
74LVC574APW-Q100 | 1.2 - 3.6 | CMOS/LVTTL | ± 24 | 3.2 | 150 | low | -40~125 | TSSOP20 |
Package
Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
---|---|---|---|---|---|---|---|
74LVC574ABQ-Q100 | 74LVC574ABQ-Q100X (935691607115) |
Active | LVC574A |
![]() DHVQFN20 (SOT764-1) |
SOT764-1 | SOT764-1_115 | |
74LVC574APW-Q100 | 74LVC574APW-Q100J (935691608118) |
Active | LVC574A |
![]() TSSOP20 (SOT360-1) |
SOT360-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT360-1_118 |
Environmental information
Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
---|---|---|---|---|
74LVC574ABQ-Q100 | 74LVC574ABQ-Q100X | 74LVC574ABQ-Q100 |
|
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74LVC574APW-Q100 | 74LVC574APW-Q100J | 74LVC574APW-Q100 |
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Documentation (9)
File name | Title | Type | Date |
---|---|---|---|
74LVC574A_Q100 | Octal D-type flip-flop with 5 V tolerant inputs/outputs; positive edge-trigger; 3-state | Data sheet | 2023-11-02 |
SOT764-1 | 3D model for products with SOT764-1 package | Design support | 2019-10-03 |
SOT360-1 | 3D model for products with SOT360-1 package | Design support | 2020-01-22 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
DHVQFN20_SOT764-1_mk | plastic, dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 2.5 mm x 4.5 mm x 0.85 mm body | Marcom graphics | 2017-01-28 |
TSSOP20_SOT360-1_mk | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
SOT764-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 4.5 mm x 2.5 mm x 1 mm body | Package information | 2022-06-21 |
SOT360-1 | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.1 mm body | Package information | 2022-06-21 |
SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
Support
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Ordering, pricing & availability
Sample
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