Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 74HC4067PW-Q100

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

12NC OPN Type No. Package State MSL
93530664211874HC4067PW-Q100J74HC4067PW-Q100SOT355 (TSSOP24)RFS1
REACHCompliant with Regulation 1907/2006/EC (REACH). Does not contain REACH SVHC substances exceeding 1000 ppm of the article.
EU RoHSCompliant with Directive 2011/65/EU, amended by Directive 2015/863/EU, on the restriction of the use of certain hazardous substances in electrical and electronic equipment ('RoHS 2 amended') without exemptions.
CN RoHSCompliant with Chinese Administration on the Control of Pollution Caused by Electronic Information Products (ACPEIP; CN RoHS).
ELVCompliant with Directive 2000/53/EC, amended by Directive 2023/533, on end of life vehicles (ELV) without exemptions.
PFASDoes not contain any intentionally added per- and polyfluoroalkyl substances (PFAS).
CA Proposition 65Contains California Proposition 65 substance(s) [at the article level]: substance 7440-02-0: 14439 ppm; substance 1333-86-4: 1115 ppm;
IEC 62474Contains IEC 62474 substance(s) [at the article level]: substance 7440-02-0: 14439 ppm; substance 1333-86-4: 1115 ppm;
Precious MetalsContains precious metals [Ag, Au, Pd, Pt; at the article level]: substance 7440-22-4: 2116 ppm; substance 7440-05-3: 485 ppm; substance 7440-57-5: 469 ppm;
RHF IndicatorLead-free and halogen-free according to Nexperia's halogen-free definition.
RHF-2006 indicator DEU/CN RoHS compliantHalogen-free
Material Material Group Substance CAS No. Mass (mg) Material (%) Product (%)
AdhesiveFillerSilver (Ag)7440-22-40.16481377.9000000.186595
AdhesivePolymerAcrylic resin0.03215915.2000000.036409
AdhesivePolymerResin system0.0145986.9000000.016527
Adhesive Total0.211570100.0000000.239531
DieDoped siliconSilicon (Si)7440-21-31.670894100.0000001.891719
Die Total1.670894100.0000001.891719
Lead FrameCopper alloyCopper (Cu)7440-50-834.76102993.83427239.355033
Lead FrameCopper alloyIron (Fe)7439-89-60.8559192.3104760.969037
Lead FrameCopper alloyZinc (Zn)7440-66-60.0356630.0962690.040377
Lead FrameCopper alloyPhosphorus (P)7723-14-00.0106990.0288810.012113
Lead FramePure metal layerNickel (Ni)7440-02-01.2754203.4428821.443979
Lead FramePure metal layerPalladium (Pd)7440-05-30.0428360.1156320.048498
Lead FramePure metal layerGold (Au)7440-57-50.0414550.1119040.046933
Lead FramePure metal layerSilver (Ag)7440-22-40.0221090.0596810.025031
Lead Frame Total37.045130100.00000041.941001
Mould CompoundFillerSilica fused60676-86-038.57227778.33000043.669975
Mould CompoundPolymerEpoxy resin system4.3639418.8620004.940678
Mould CompoundFlame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-83.0038416.1000003.400828
Mould CompoundPolymerPhenolic resin2.9092945.9080003.293785
Mould CompoundFillerSilica -amorphous-7631-86-90.2954600.6000000.334508
Mould CompoundPigmentCarbon black1333-86-40.0984870.2000000.111503
Mould Compound Total49.243300100.00000055.751277
WirePure metalCopper (Cu)7440-50-80.155872100.0000000.176472
Wire Total0.155872100.0000000.176472
74HC4067PW-Q100 Total88.326766100.000000100.000000
Notes
Report created on 2024-10-26 17:41:43 CEST+0200
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.
Pb-free Soldering Pb Soldering No. of Processing Cycles
PPT MPPT PPT MPPT
260 °C40 s235 °C30 s3
Notes
Report created on 2024-10-26 17:41:43 CEST+0200
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.
部件名称
Material
有毒或有害物质和元素 (Toxic or hazardous substances and elements)
铅 (Pb) 镉 (Cd) 汞 (Hg) 六价铬 (Cr6+) 多溴联苯 (PBB) 多溴二苯醚 (PBDE)
胶黏剂 (Adhesive)
半导体芯片 (Die)
引线框架 (Lead Frame)
模封料 (Mould Compound)
导线 (Wire)
表示该有害物质在该部件所有均质材料中的含量均在 GB/T 26572 规定的限量要求以下
Indicates that said hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement of GB/T 26572.
表示该有害物质至少在该部件的某一均质材料中的含量超出 GB/T 26572 规定的限量要求
Indicates that said hazardous substance contained in at least one of the homogeneous materials used for this part is above the limit requirement of GB/T 26572.
  该半导体产品具有无限期的环保使用期限(EFUP)。
This semiconductor product has an indefinite environmental friendly use period (EFUP).
Notes
Report created on 2024-10-26 17:41:43 CEST+0200
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.