Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 74HC574BQ

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74HC574BQSOT764-1DHVQFN2028.003588 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9356912751153126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.0008531.0000000.003045
FillerSilver (Ag)7440-22-40.06396075.0000000.228399
PolymerAcrylic resinProprietary0.0051176.0000000.018272
Resin systemProprietary0.01535018.0000000.054816
subTotal0.085280100.0000000.304532
DieDoped siliconSilicon (Si)7440-21-30.315389100.0000001.126244
subTotal0.315389100.0000001.126244
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-810.58916097.47000037.813584
Iron (Fe)7439-89-60.2607362.4000000.931082
Phosphorus (P)7723-14-00.0032590.0300000.011639
Zinc (Zn)7440-66-60.0108640.1000000.038795
subTotal10.864020100.00000038.795100
Mould CompoundAdditiveNon hazardousProprietary0.4886272.9840001.744874
FillerSilica -amorphous-7631-86-90.5714843.4900002.040754
Silica fused60676-86-013.88919984.82000049.597925
Flame retardantFlame retardant, organic phosphorus compoundProprietary0.1640771.0020000.585913
PigmentCarbon black1333-86-40.0268550.1640000.095898
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-70.6060353.7010002.164135
Epoxy resin systemProprietary0.2597061.5860000.927403
Phenolic resinProprietary0.3689272.2530001.317427
subTotal16.374910100.00000058.474328
Pre-PlatingPure metal layerGold (Au)7440-57-50.0027581.0000000.009848
Nickel (Ni)7440-02-00.25095191.0000000.896138
Palladium (Pd)7440-05-30.0220628.0000000.078781
subTotal0.275770100.0000000.984767
WirePure metalCopper (Cu)7440-50-80.08517696.5500000.304161
Pure metal layerGold (Au)7440-57-50.0003090.3500000.001103
Palladium (Pd)7440-05-30.0027353.1000000.009766
subTotal0.088220100.0000000.315030
total28.003588100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.