Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BUK7K45-100E

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BUK7K45-100ESOT1205LFPAK56D91.660000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340679441154126030 s126020 s3Leaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-32.800000100.0000003.054768
subTotal2.800000100.0000003.054768
ClipCopper alloyCopper (Cu)7440-50-813.17360099.80000014.372245
Iron (Fe)7439-89-60.0198000.1500000.021602
Phosphorus (P)7723-14-00.0066000.0500000.007201
subTotal13.200000100.00000014.401047
Lead FrameCopper alloyCopper (Cu)7440-50-835.32920099.80000038.543749
Iron (Fe)7439-89-60.0531000.1500000.057931
Phosphorus (P)7723-14-00.0177000.0500000.019310
subTotal35.400000100.00000038.620991
Mould CompoundAdditiveNon hazardousProprietary1.8908005.8000002.062841
FillerSilica -amorphous-7631-86-92.0538006.3000002.240672
Silica fused60676-86-023.47200072.00000025.607681
Flame retardantAntimony Trioxide (Sb2O3)1309-64-40.6520002.0000000.711324
PigmentCarbon black1333-86-40.0978000.3000000.106699
PolymerBromophenol/Formaldehyde/Epichlorohydrin polymer68541-56-00.7172002.2000000.782457
Epoxy resin systemProprietary1.9560006.0000002.133973
Phenol Formaldehyde resin (generic)9003-35-41.7604005.4000001.920576
subTotal32.600000100.00000035.566223
Post-PlatingImpurityNon hazardousProprietary0.0001930.0100000.000211
Tin alloyTin (Sn)7440-31-51.92980799.9900002.105397
subTotal1.930000100.0000002.105608
Solder PasteLead alloyLead (Pb)7439-92-11.72050092.5000001.877046
Silver (Ag)7440-22-40.0465002.5000000.050731
Tin (Sn)7440-31-50.0930005.0000000.101462
subTotal1.860000100.0000002.029238
Solder PasteImpurityAntimony (Sb)7440-36-00.0011610.0300000.001267
Lead alloyLead (Pb)7439-92-13.57858992.4700003.904199
Silver (Ag)7440-22-40.0967502.5000000.105553
Tin (Sn)7440-31-50.1935005.0000000.211106
subTotal3.870000100.0000004.222125
total91.660000100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.