Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BUK7M10-40E

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BUK7M10-40ESOT1210mLFPAK37.620000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340700831151126030 s126020 s3Leaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-31.200000100.0000003.189793
subTotal1.200000100.0000003.189793
ClipCopper alloyCopper (Cu)7440-50-85.68860099.80000015.121212
Iron (Fe)7439-89-60.0085500.1500000.022727
Phosphorus (P)7723-14-00.0028500.0500000.007576
subTotal5.700000100.00000015.151515
Lead FrameCopper alloyCopper (Cu)7440-50-813.87220099.80000036.874535
Iron (Fe)7439-89-60.0208500.1500000.055423
Phosphorus (P)7723-14-00.0069500.0500000.018474
subTotal13.900000100.00000036.948432
Mould CompoundFillerSilica fused60676-86-05.28860062.00000014.057948
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-21.32215015.5000003.514487
ImpuritySilicon Dioxide (SiO2)14808-60-70.0170600.2000000.045348
PigmentCarbon black1333-86-40.0426500.5000000.113371
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-70.1706002.0000000.453482
Epichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.93830011.0000002.494152
Phenolic resinProprietary0.7506408.8000001.995322
subTotal8.530000100.00000022.674110
Post-PlatingImpurityNon hazardousProprietary0.0003850.0100000.001023
Tin alloyTin (Sn)7440-31-53.84961599.99000010.232895
subTotal3.850000100.00000010.233918
Solder PasteLead alloyLead (Pb)7439-92-14.10700092.50000010.917065
Silver (Ag)7440-22-40.1110002.5000000.295056
Tin (Sn)7440-31-50.2220005.0000000.590112
subTotal4.440000100.00000011.802233
total37.620000100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.