Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BUK9J0R9-40H

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BUK9J0R9-40HSOT1023LFPAK56E115.350000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346603691153126030 s126020 s3Leaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-31.700000100.0000001.473775
subTotal1.700000100.0000001.473775
ClipCopper alloyCopper (Cu)7440-50-827.34520099.80000023.706285
Iron (Fe)7439-89-60.0411000.1500000.035631
Phosphorus (P)7723-14-00.0137000.0500000.011877
subTotal27.400000100.00000023.753793
Lead FrameCopper alloyCopper (Cu)7440-50-840.34748099.87000034.978309
Iron (Fe)7439-89-60.0404000.1000000.035024
Phosphorus (P)7723-14-00.0121200.0300000.010507
subTotal40.400000100.00000035.023840
Mould CompoundFillerSilica fused60676-86-018.81080062.00000016.307586
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-24.70270015.5000004.076896
ImpuritySilicon Dioxide (SiO2)14808-60-70.0606800.2000000.052605
PigmentCarbon black1333-86-40.1517000.5000000.131513
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-70.6068002.0000000.526051
Epichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-23.33740011.0000002.893281
Phenolic resinProprietary2.6699208.8000002.314625
subTotal30.340000100.00000026.302557
Post-PlatingImpurityNon hazardousProprietary0.0001730.0100000.000150
Tin alloyTin (Sn)7440-31-51.72982799.9900001.499633
subTotal1.730000100.0000001.499783
Solder PasteLead alloyLead (Pb)7439-92-13.82950092.5000003.319896
Silver (Ag)7440-22-40.1035002.5000000.089727
Tin (Sn)7440-31-50.2070005.0000000.179454
subTotal4.140000100.0000003.589077
Solder PasteImpurityAntimony (Sb)7440-36-00.0028920.0300000.002507
Lead alloyLead (Pb)7439-92-18.91410892.4700007.727879
Silver (Ag)7440-22-40.2410002.5000000.208929
Tin (Sn)7440-31-50.4820005.0000000.417859
subTotal9.640000100.0000008.357174
total115.350000100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.