Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BUK9K89-100E

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BUK9K89-100ESOT1205LFPAK56D78.987200 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340669871155126030 s126020 s3Leaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-31.660000100.0000002.101606
subTotal1.660000100.0000002.101606
ClipCopper alloyCopper (Cu)7440-50-84.99998099.8000006.330114
Iron (Fe)7439-89-60.0075150.1500000.009514
Phosphorus (P)7723-14-00.0025050.0500000.003171
subTotal5.010000100.0000006.342800
Lead FrameCopper alloyCopper (Cu)7440-50-835.32920099.80000044.727753
Iron (Fe)7439-89-60.0531000.1500000.067226
Phosphorus (P)7723-14-00.0177000.0500000.022409
subTotal35.400000100.00000044.817388
Mould CompoundAdditiveNon hazardousProprietary1.8908005.8000002.393806
FillerSilica -amorphous-7631-86-92.0538006.3000002.600168
Silica fused60676-86-023.47200072.00000029.716207
Flame retardantAntimony Trioxide (Sb2O3)1309-64-40.6520002.0000000.825450
PigmentCarbon black1333-86-40.0978000.3000000.123818
PolymerBromophenol/Formaldehyde/Epichlorohydrin polymer68541-56-00.7172002.2000000.907995
Epoxy resin systemProprietary1.9560006.0000002.476351
Phenol Formaldehyde resin (generic)9003-35-41.7604005.4000002.228716
subTotal32.600000100.00000041.272510
Post-PlatingImpurityNon hazardousProprietary0.0001930.0100000.000244
Tin alloyTin (Sn)7440-31-51.92980799.9900002.443190
subTotal1.930000100.0000002.443434
Solder PasteLead alloyLead (Pb)7439-92-10.62160092.5000000.786963
Silver (Ag)7440-22-40.0168002.5000000.021269
Tin (Sn)7440-31-50.0336005.0000000.042539
subTotal0.672000100.0000000.850771
Solder PasteImpurityAntimony (Sb)7440-36-00.0005150.0300000.000651
Lead alloyLead (Pb)7439-92-11.58604592.4700002.007978
Silver (Ag)7440-22-40.0428802.5000000.054287
Tin (Sn)7440-31-50.0857605.0000000.108575
subTotal1.715200100.0000002.171491
total78.987200100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.