Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PDTA113ZMB

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PDTA113ZMBSOT883BXQFN30.690247 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934065919315512601235
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.00228076.0000000.330317
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.00031410.4700000.045505
Phenolic resinProprietary0.00040613.5300000.058805
subTotal0.003000100.0000000.434627
DieDoped siliconSilicon (Si)7440-21-30.040000100.0000005.795027
subTotal0.040000100.0000005.795027
Lead FrameCopper alloyChromium (Cr)7440-47-30.0006720.2400000.097356
Copper (Cu)7440-50-80.26320094.00000038.131278
Tin (Sn)7440-31-50.0006720.2400000.097356
Zinc (Zn)7440-66-60.0005880.2100000.085187
Pure metal layerGold (Au)7440-57-50.0002240.0800000.032452
Nickel (Ni)7440-02-00.0138324.9400002.003920
Palladium (Pd)7440-05-30.0008120.2900000.117639
subTotal0.280000100.00000040.565189
Mould CompoundFillerSilica -amorphous-7631-86-90.07820023.00000011.329278
Silica fused60676-86-00.20400060.00000029.554638
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-20.0102003.0000001.477732
Ion trapping agentBismuth (Bi)7440-69-90.0017000.5000000.246289
PigmentCarbon black1333-86-40.0017000.5000000.246289
PolymerEpoxy resin systemProprietary0.0238007.0000003.448041
Phenolic resinProprietary0.0204006.0000002.955464
subTotal0.340000100.00000049.257729
Post-PlatingImpurityLead (Pb)7439-92-10.0000010.0045000.000130
Non hazardousProprietary0.0000110.0555000.001608
Tin solderTin (Sn)7440-31-50.01998899.9400002.895775
subTotal0.020000100.0000002.897513
WireImpurityNon hazardousProprietary0.0000010.0100000.000105
Pure metalGold (Au)7440-57-50.00724699.9900001.049780
subTotal0.007247100.0000001.049885
total0.690247100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.