Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PESD5V0S4UF

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PESD5V0S4UFSOT886XSON61.996640 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340612011159126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.03800076.0000001.903197
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.00523510.4700000.262190
Phenolic resinProprietary0.00676513.5300000.338819
subTotal0.050000100.0000002.504207
DieDoped siliconSilicon (Si)7440-21-30.110000100.0000005.509256
subTotal0.110000100.0000005.509256
Lead FrameCopper alloyCopper (Cu)7440-50-80.72443091.70000036.282455
Magnesium (Mg)7439-95-40.0013430.1700000.067263
Nickel (Ni)7440-02-00.0241743.0600001.210734
Silicon (Si)7440-21-30.0054510.6900000.273009
Pure metal layerGold (Au)7440-57-50.0004740.0600000.023740
Nickel (Ni)7440-02-00.0312053.9500001.562876
Palladium (Pd)7440-05-30.0029230.3700000.146396
subTotal0.790000100.00000039.566472
Mould CompoundFillerSilica -amorphous-7631-86-90.23000023.00000011.519353
Silica fused60676-86-00.60000060.00000030.050485
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-20.0300003.0000001.502524
Ion trapping agentBismuth (Bi)7440-69-90.0050000.5000000.250421
PigmentCarbon black1333-86-40.0050000.5000000.250421
PolymerEpoxy resin systemProprietary0.0700007.0000003.505890
Phenolic resinProprietary0.0600006.0000003.005048
subTotal1.000000100.00000050.084141
Post-PlatingImpurityAntimony (Sb)7440-36-00.0000010.0030000.000045
Bismuth (Bi)7440-69-90.0000000.0010000.000015
Copper (Cu)7440-50-80.0000000.0010000.000015
Lead (Pb)7439-92-10.0000020.0050000.000075
Tin solderTin (Sn)7440-31-50.02999799.9900001.502374
subTotal0.030000100.0000001.502524
WireImpurityNon hazardousProprietary0.0000020.0100000.000083
Pure metalGold (Au)7440-57-50.01663899.9900000.833317
subTotal0.016640100.0000000.833400
total1.996640100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.