Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PESD5V0U2BM

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PESD5V0U2BMSOT883XQFN30.857120 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340619473151012601235
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.00760076.0000000.886690
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.00104710.4700000.122153
Phenolic resinProprietary0.00135313.5300000.157854
subTotal0.010000100.0000001.166698
DieDoped siliconSilicon (Si)7440-21-30.030000100.0000003.500093
subTotal0.030000100.0000003.500093
Lead FrameCopper alloyCopper (Cu)7440-50-80.40166393.41000046.861933
Magnesium (Mg)7439-95-40.0006280.1460000.073245
Nickel (Ni)7440-02-00.0125262.9130001.461394
Silicon (Si)7440-21-30.0027130.6310000.316560
MetallisationGold (Au)7440-57-50.0001500.0350000.017559
Nickel (Ni)7440-02-00.0118462.7550001.382129
Palladium (Pd)7440-05-30.0004730.1100000.055185
subTotal0.430000100.00000050.168004
Mould CompoundFillerSilica -amorphous-7631-86-90.08510023.0000009.928598
Silica fused60676-86-00.22200060.00000025.900691
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-20.0111003.0000001.295035
Ion trapping agentBismuth (Bi)7440-69-90.0018500.5000000.215839
PigmentCarbon black1333-86-40.0018500.5000000.215839
PolymerEpoxy resin systemProprietary0.0259007.0000003.021747
Phenolic resinProprietary0.0222006.0000002.590069
subTotal0.370000100.00000043.167818
Post-PlatingImpurityLead (Pb)7439-92-10.0000000.0045000.000053
Non hazardousProprietary0.0000060.0555000.000648
Tin solderTin (Sn)7440-31-50.00999499.9400001.165998
subTotal0.010000100.0000001.166698
WireImpurityNon hazardousProprietary0.0000010.0100000.000083
Pure metalGold (Au)7440-57-50.00711999.9900000.830606
subTotal0.007120100.0000000.830689
total0.857120100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.