Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PIMN31PA

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PIMN31PASOT1118HUSON67.039720 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346660691152126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.06240080.0000000.886399
PolymerAcrylic resinProprietary0.01560020.0000000.221600
subTotal0.078000100.0000001.107999
DieDoped siliconSilicon (Si)7440-21-30.184000100.0000002.613740
subTotal0.184000100.0000002.613740
Lead FrameCopper alloyCopper (Cu)7440-50-82.55941095.11000036.356703
Magnesium (Mg)7439-95-40.0053820.2000000.076452
Nickel (Ni)7440-02-00.0853053.1700001.211763
Silicon (Si)7440-21-30.0185680.6900000.263759
Pure metal layerGold (Au)7440-57-50.0005380.0200000.007645
Nickel (Ni)7440-02-00.0199130.7400000.282872
Palladium (Pd)7440-05-30.0018840.0700000.026758
subTotal2.691000100.00000038.225952
Mould CompoundFillerSilica -amorphous-7631-86-90.89424023.00000012.702778
Silica fused60676-86-02.33280060.00000033.137682
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-20.1166403.0000001.656884
Ion trapping agentBismuth (Bi)7440-69-90.0194400.5000000.276147
PigmentCarbon black1333-86-40.0194400.5000000.276147
PolymerEpoxy resin systemProprietary0.2721607.0000003.866063
Phenolic resinProprietary0.2332806.0000003.313768
subTotal3.888000100.00000055.229469
Post-PlatingImpurityLead (Pb)7439-92-10.0000070.0045000.000105
Non hazardousProprietary0.0000910.0555000.001293
Tin solderTin (Sn)7440-31-50.16390299.9400002.328240
subTotal0.164000100.0000002.329638
WireImpurityNon hazardousProprietary0.0000030.0100000.000049
Pure metalGold (Au)7440-57-50.03471799.9900000.493152
subTotal0.034720100.0000000.493201
total7.039720100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.