Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PMPB12UNE

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMPB12UNESOT1220DFN2020MD-67.234925 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340688391155126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.05600080.0000000.774023
PolymerAcrylic resinProprietary0.01400020.0000000.193506
subTotal0.070000100.0000000.967529
DieDoped siliconSilicon (Si)7440-21-30.310000100.0000004.284771
subTotal0.310000100.0000004.284771
Lead FrameCopper alloyCopper (Cu)7440-50-82.70491393.59560037.386882
Magnesium (Mg)7439-95-40.0042170.1459000.058280
Nickel (Ni)7440-02-00.0843532.9188001.165918
Silicon (Si)7440-21-30.0182760.6324000.252613
Pure metal layerGold (Au)7440-57-50.0009620.0333000.013302
Nickel (Ni)7440-02-00.0740132.5610001.022995
Palladium (Pd)7440-05-30.0032660.1130000.045138
subTotal2.890000100.00000039.945127
Mould CompoundFillerSilica -amorphous-7631-86-90.85790023.00000011.857759
Silica fused60676-86-02.23800060.00000030.933285
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-20.1119003.0000001.546664
Ion trapping agentBismuth (Bi)7440-69-90.0186500.5000000.257777
PigmentCarbon black1333-86-40.0186500.5000000.257777
PolymerEpoxy resin systemProprietary0.2611007.0000003.608883
Phenolic resinProprietary0.2238006.0000003.093329
subTotal3.730000100.00000051.555476
Post-PlatingImpurityLead (Pb)7439-92-10.0000080.0045000.000106
Non hazardousProprietary0.0000940.0555000.001304
Tin solderTin (Sn)7440-31-50.16989899.9400002.348304
subTotal0.170000100.0000002.349713
WireImpurityNon hazardousProprietary0.0000060.0100000.000090
Pure metalCopper (Cu)7440-50-80.06491999.9900000.897293
subTotal0.064925100.0000000.897383
total7.234925100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.