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Nexperia launches miniaturized leadless logic ICs to save space and enhance reliability in automotive applications

Nexperia launches miniaturized leadless logic ICs to save space and enhance reliability in automotive applications

December 05, 2024

Nijmegen -- 75% PCB area savings and side wettable flanks to support optical inspection

Nexperia introduced today a new portfolio of logic ICs in tiny automotive-qualified MicroPak XSON5 leadless packaging. Miniaturized logic ICs are essential for space constrained applications including sophisticated automotive applications such as chassis safety systems, battery monitoring, infotainment units, and advanced driver assistance systems (ADAS). MicroPak XSON5 is a thermally enhanced plastic enclosure with a 75% smaller PCB footprint than traditional leaded mini logic packages, that also features side-wettable flanks to support automated optical inspection (AOI) of solder joints.

This release reinforces Nexperia's leadership position in the logic industry with innovative packaging that meets the growing requirements of the automotive industry. Leadless packaging with side-wettable flanks improves manufacturing reliability by allowing the use of AOI techniques to examine the quality of solder joints, thereby accelerating board production. This helps to reduce costs while still meeting the strict criteria of perfectly soldered joints.

Nexperia’s SOT8065-1 MicroPak XSON5 has 5 terminals and measures only 1.1mm × 0.85mm × 0.47mm, making it ideal for use in space-constrained automotive applications. It is free from delamination and offers highest immunity to moisture MSL-1. Uniform 7 mm Sn layer on pad sides and bottom to prevent oxidation and is RoHS and dark green compliant. SOT8065-1 devices use the same die as in the SOT353 package but offers a smaller PCB footprint with superior solder durability and enhanced electrical performance.

To address the automotive industry’s burgeoning demand for miniaturized logic ICs, Nexperia offers 64 AEC-Q100 certified devices in MicroPak XSON5 packaging. To learn more about the Nexperia’s portfolio of miniaturaized logic ICs, visit https://www.nexperia.com/packages/SOT8065-1.html

About Nexperia

Headquartered in the Netherlands, Nexperia is a global semiconductor company with a rich European history and over 14,000 employees across Europe, Asia, and the United States. As a leading expert in the development and production of essential semiconductors, Nexperia’s components enable the basic functionality of virtually every commercial electronic design in the world – from automotive and industrial to mobile and consumer applications.
The company serves a global customer base, shipping more than 100 billion products annually. These products are recognized as benchmarks in efficiency – in process, size, power, and performance. Nexperia's commitment to innovation, efficiency, sustainability, and stringent industry requirements is evident in its extensive IP portfolio, its expanding product range, and its certification to IATF 16949, ISO 9001, ISO 14001, and ISO 45001 standards.

 

For press information, please contact:

Nexperia

Anne Proch

Tel: +49 160 916 884 18

Email: anne.proch@nexperia.com

 

Publitek

Megan King

Tel: +44 7855060775

E-mail: megan.king@publitek.com