Nexperia Announces 80% Smaller Automotive Power MOSFET Package

Nexperia, the former Standard Products division of NXP, today announced the availability of its automotive power MOSFETs in the new, LFPAK33, thermally-enhanced, loss-free package which has a footprint more than 80 percent smaller than industry standard devices. LFPAK33 devices also feature a significantly lower resistance responding to growing industry pressure to reduce the size of modules in the car while continuing to improve energy efficiency and reliability. LFPAK33 MOSFETs enable the power infrastructure that allows next-generation automotive subsystems such as radar and ADAS technology to operate reliably and efficiently.

The Nexperia LFPAK33 package uses a copper clip design to reduce the package resistance and inductance which in turn reduces the RDS(on) and losses of the MOSFET. The resulting package has an ultra-compact footprint of 10.9 mm², and because no wires or glue is used internally, operating temperatures of up to 175^oC T­_j max are possible. Devices can handle up to 70 A, and the extensive product portfolio includes devices that range between 30 V – 100 V and an R_DS(on) as low as 6.3 mΩ.

“As more subsystems are crammed into cars the need for rugged, compact power systems is becoming ever greater,” said Richard Ogden, International Product Marketing Engineer at Nexperia. “This extension of our LFPAK portfolio provides designers with more product choices than anywhere else on the market today.”

Target applications include: connected auto modules, next generation engine management systems; chassis and safety technology; LED lighting; relay replacement; C2X, radar, infotainment and navigation systems; and ADAS. MOSFETS in the new LFPAK33 compact automotive power package are available now, visit http://www.nexperia.com/products/automotive-qualified-products-q100-q101/automotive-mosfets/family/LFPAK33/

About Nexperia

Nexperia, the former Standard Products division of NXP, is a dedicated global leader in Discretes, Logic and MOSFETs devices. The company became independent at the beginning of 2017. Focused on efficiency, Nexperia produces consistently reliable semiconductor components at high volume: 85 billion annually. Our extensive portfolio meets the stringent standards set by the Automotive industry. Industry-leading, miniature packages, produced in our own manufacturing facilities, combine power and thermal efficiency with best-in-class quality levels.

With over 50 years history supplying to the world’s biggest companies, Nexperia has 11,000 employees across Asia, Europe and the U.S., offering global support. The company has an extensive IP portfolio and is certified to ISO9001, ISO/TS16949, ISO14001 and OHSAS18001.

Nexperia: Efficiency wins.

For press information, please contact:

Nexperia

Petra Beekmans, Head of Communications & Branding
Phone: +31 6 137 111 41
Email: petra.beekmans@nexperia.com

Agency: BWW Communications

Nick Foot, director
+44-1491-636393
Nick.foot@bwwcomms.com