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Design challenges
- Max Vdrop can be controlled by adding a Zener before the ballast. As well as providing a second output (e.g. 24 V for the relay), the voltage of the relays can be adjusted to have the best price compromise
- Using an LFPAK56 eliminates the need for a heat spreader to dissipate the power in the ballast (Vdrop x 50 mA – (24-5)*50 mA = 0.95 W)
- Clip-bonding package provides best thermal performance (much better Rth) with no heatsink or copper surface to dissipate power
MOSFET and GaN FET Handbook
Drawing on over 20 years’ of experience, the MOSFET and GaN FET Application Handbook: A Power Design Engineer’s Guide brings together a comprehensive set of learning and reference materials relating to the use of MOSFETs and GaN FETs in real world systems.
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