Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PHP18NQ10T

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

12NC OPN Type No. Package State MSL
934055698127PHP18NQ10T,127PHP18NQ10TSOT78 (SIL3P)DODNone
REACHCompliant with Regulation 1907/2006/EC (REACH). Does not contain REACH SVHC substances exceeding 1000 ppm of the article.
EU RoHSCompliant with Directive 2011/65/EU, amended by Directive 2015/863/EU, on the restriction of the use of certain hazardous substances in electrical and electronic equipment ('RoHS 2 amended'); using exemption 7(a): 'Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead).'.
CN RoHSNot compliant with Chinese ACPEIP (Administration on the Control of Pollution Caused by Electronic Information Products) (CN RoHS).
ELVCompliant with Directive 2000/53/EC, amended by Directive 2023/533, on end of life vehicles (ELV); using exemption 8(e): 'Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead).'.
PFASDoes not contain any intentionally added per- and polyfluoroalkyl substances (PFAS).
CA Proposition 65Contains California Proposition 65 substance(s) [at the article level]: substance 7439-92-1: 987 ppm; substance 7440-02-0: 7267 ppm; substance 1333-86-4: 1142 ppm;
IEC 62474Contains IEC 62474 substance(s) [at the article level]: substance 7439-92-1: 987 ppm; substance 7440-02-0: 7267 ppm; substance 1333-86-4: 1142 ppm;
Precious MetalsContains precious metals [Ag, Au, Pd, Pt; at the article level]: substance 7440-22-4: 16 ppm;
RHF IndicatorContains EU RoHS-exempted lead and halogen-free according to Nexperia's halogen-free definition.
RHF-2006 indicator HEU RoHS compliantHalogen-free
Material Material Group Substance CAS No. Mass (mg) Material (%) Product (%)
Solder WireLead alloyLead (Pb)7439-92-11.92610093.5000000.098770
Solder WireLead alloyTin (Sn)7440-31-50.1030005.0000000.005282
Solder WireLead alloySilver (Ag)7440-22-40.0309001.5000000.001585
Solder Wire Total2.060000100.0000000.105637
DieDoped siliconSilicon (Si)7440-21-32.300000100.0000000.117944
Die Total2.300000100.0000000.117944
Lead FrameCopper alloyCopper (Cu)7440-50-81318.30172098.60000067.602595
Lead FrameCopper alloyNickel (Ni)7440-02-014.1724121.0600000.726762
Lead FrameCopper alloyPhosphorus (P)7723-14-03.2088480.2400000.164550
Lead FrameCopper alloyIron (Fe)7439-89-61.3370200.1000000.068563
Lead Frame Total1337.020000100.00000068.562470
Mould CompoundFillerMisc. silica compounds (generic)398.76188071.60000020.448534
Mould CompoundFlame retardantMetal hydroxide55.69300010.0000002.855941
Mould CompoundPolymerEpoxy resin system55.69300010.0000002.855941
Mould CompoundPolymerPhenolic resin44.5544008.0000002.284752
Mould CompoundPigmentCarbon black1333-86-42.2277200.4000000.114238
Mould Compound Total556.930000100.00000028.559406
Post-PlatingTin alloyTin (Sn)7440-31-547.50524999.9900002.436072
Post-PlatingImpurityNon-declarable0.0047510.0100000.000244
Post-Plating Total47.510000100.0000002.436316
Wire 1Pure metalAluminium (Al)7429-90-54.00007399.9900000.205123
Wire 1ImpurityNon-declarable0.0004000.0100000.000021
Wire Total4.000473100.0000000.205144
Wire 1 Total4.000473100.0000000.205144
Wire 2Pure metalAluminium (Al)7429-90-50.25510699.9900000.013082
Wire 2ImpurityNon-declarable0.0000260.0100000.000001
Wire Total0.255132100.0000000.013083
Wire 2 Total0.255132100.0000000.013083
PHP18NQ10T Total1950.075605100.000000100.000000
Notes
Report created on 2024-12-21 22:24:11 CET+0100
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.
部件名称
Material
有毒或有害物质和元素 (Toxic or hazardous substances and elements)
铅 (Pb) 镉 (Cd) 汞 (Hg) 六价铬 (Cr6+) 多溴联苯 (PBB) 多溴二苯醚 (PBDE)
焊锡丝 (Solder Wire)
半导体芯片 (Die)
引线框架 (Lead Frame)
模封料 (Mould Compound)
后镀层 (Post-Plating)
导线 (Wire)
导线 (Wire)
表示该有害物质在该部件所有均质材料中的含量均在 GB/T 26572 规定的限量要求以下
Indicates that said hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement of GB/T 26572.
表示该有害物质至少在该部件的某一均质材料中的含量超出 GB/T 26572 规定的限量要求
Indicates that said hazardous substance contained in at least one of the homogeneous materials used for this part is above the limit requirement of GB/T 26572.
  该半导体产品具有无限期的环保使用期限(EFUP)。
This semiconductor product has an indefinite environmental friendly use period (EFUP).
Notes
Report created on 2024-12-21 22:24:11 CET+0100
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.