Package information
Package information | Package name | Package description | Reference | Date |
---|---|---|---|---|
OL-PMCM6501FNE | WLCSP | wafer level chip-scale package; 6 bumps; 1.48 x 0.98 x 0.35 mm | 2020-12-09 |
Related documents
File name | Title | Type | Date |
---|---|---|---|
OL-PMCM6501FNE | wafer level chip-scale package; 6 bumps; 1.48 x 0.98 x 0.35 mm | Package information | 2020-12-14 |