Package information
| Package information | Package name | Package description | Reference | Date |
|---|---|---|---|---|
| SOT8073-1 | FCLGA3 | flip chip land gid array package; no leads; body: 3.2 x 2.2 x 0.774 mm, 3-pad | MO-303 compatible (JEDEC) | 2023-03-13 |
Related documents
| File name | Title | Type | Date |
|---|---|---|---|
| SOT8073-1 | flip chip land gid array package; no leads; body: 3.2 x 2.2 x 0.774 mm, 3-pad | Package information | 2023-03-21 |
| SOT8073-1_328 | FCLGA; Reel dry pack for SMD, 7"; Q2/T3 product orientation | Packing information | 2023-04-18 |
Products in this package
GaN FETs
| Type number | Description | Quick access |
|---|---|---|
| GAN7R0-150LBE | 150 V, 7 mOhm Gallium Nitride (GaN) FET in a 2.2 mm x 3.2 mm x 0.774 mm Land Grid Array (LGA) package |