Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 74HCT27BQ

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74HCT27BQSOT762-1DHVQFN1417.941091 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
93528367911513126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.0002331.0000000.001296
FillerSilver (Ag)7440-22-40.01744575.0000000.097235
PolymerAcrylic resinProprietary0.0013966.0000000.007779
Resin systemProprietary0.00418718.0000000.023336
subTotal0.023260100.0000000.129647
DieDoped siliconSilicon (Si)7440-21-30.189196100.0000001.054540
subTotal0.189196100.0000001.054540
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-86.80297297.47000037.918387
Iron (Fe)7439-89-60.1675092.4000000.933663
Phosphorus (P)7723-14-00.0020940.0300000.011671
Zinc (Zn)7440-66-60.0069800.1000000.038903
subTotal6.979555100.00000038.902623
Mould CompoundAdditiveNon hazardousProprietary0.3139172.9840001.749709
FillerSilica -amorphous-7631-86-90.3671483.4900002.046408
Silica fused60676-86-08.92306484.82000049.735348
Flame retardantFlame retardant, organic phosphorus compoundProprietary0.1054101.0020000.587536
PigmentCarbon black1333-86-40.0172530.1640000.096164
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-70.3893453.7010002.170131
Epoxy resin systemProprietary0.1668471.5860000.929972
Phenolic resinProprietary0.2370162.2530001.321077
subTotal10.520000100.00000058.636345
Pre-PlatingPure metal layerGold (Au)7440-57-50.0017721.0000000.009875
Nickel (Ni)7440-02-00.16123091.0000000.898664
Palladium (Pd)7440-05-30.0141748.0000000.079003
subTotal0.177176100.0000000.987543
WirePure metalCopper (Cu)7440-50-80.05011396.5500000.279319
Pure metal layerGold (Au)7440-57-50.0001820.3500000.001013
Palladium (Pd)7440-05-30.0016093.1000000.008968
subTotal0.051904100.0000000.289300
total17.941091100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.