Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 74LVC1G3157GW

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

12NC OPN Type No. Package State MSL
93527723112574LVC1G3157GW,12574LVC1G3157GWSOT363 (SC-88)RFS1
REACHCompliant with Regulation 1907/2006/EC (REACH). Does not contain REACH SVHC substances exceeding 1000 ppm of the article.
EU RoHSCompliant with Directive 2011/65/EU, amended by Directive 2015/863/EU, on the restriction of the use of certain hazardous substances in electrical and electronic equipment ('RoHS 2 amended') without exemptions.
CN RoHSCompliant with Chinese Administration on the Control of Pollution Caused by Electronic Information Products (ACPEIP; CN RoHS).
ELVCompliant with Directive 2000/53/EC, amended by Directive 2023/533, on end of life vehicles (ELV) without exemptions.
PFASContains intentionally added per- and polyfluoroalkyl substances (PFAS).
CA Proposition 65Contains California Proposition 65 substance(s) [at the article level]: substance 7439-92-1: 40 ppm; substance 1333-86-4: 1324 ppm;
IEC 62474Contains IEC 62474 substance(s) [at the article level]: substance 7439-92-1: 40 ppm; substance 1333-86-4: 1324 ppm;
Precious MetalsContains precious metals [Ag, Au, Pd, Pt; at the article level]: substance 7440-22-4: 3758 ppm;
RHF IndicatorLead-free and halogen-free according to Nexperia's halogen-free definition.
RHF-2006 indicator DEU/CN RoHS compliantHalogen-free
Material Material Group Substance CAS No. Mass (mg) Material (%) Product (%)
AdhesiveFillerSilver (Ag)7440-22-40.00735775.0000000.131210
AdhesivePolymerResin system0.00245325.0000000.043737
Adhesive Total0.009810100.0000000.174947
DieDoped siliconSilicon (Si)7440-21-30.128150100.0000002.285367
Die Total0.128150100.0000002.285367
Lead FrameCopper alloyCopper (Cu)7440-50-82.04332496.84000036.439682
Lead FrameCopper alloyIron (Fe)7439-89-60.0487412.3100000.869225
Lead FrameCopper alloyZinc (Zn)7440-66-60.0025320.1200000.045156
Lead FrameCopper alloyPhosphorus (P)7723-14-00.0014770.0700000.026341
Lead FrameCopper alloyLead (Pb)7439-92-10.0002110.0100000.003763
Lead FramePure metal layerSilver (Ag)7440-22-40.0137150.6500000.244587
Lead Frame Total2.110000100.00000037.628754
Mould CompoundFillerSilica fused60676-86-01.30204843.84000023.220115
Mould CompoundFillerSilica -amorphous-7631-86-91.04157935.07000018.575033
Mould CompoundPolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.29700010.0000005.296559
Mould CompoundPolymerPhenol Formaldehyde resin (generic)9003-35-40.2952189.9400005.264780
Mould CompoundPolymerPolyethylene (PE) -wax-9002-88-40.0267300.9000000.476690
Mould CompoundPigmentCarbon black1333-86-40.0074250.2500000.132415
Mould Compound Total2.970000100.00000052.965592
Post-PlatingTin solderTin (Sn)7440-31-50.36996399.9900006.597747
Post-PlatingImpurityLead (Pb)7439-92-10.0000180.0050000.000330
Post-PlatingImpurityAntimony (Sb)7440-36-00.0000110.0030000.000198
Post-PlatingImpurityCopper (Cu)7440-50-80.0000040.0010000.000066
Post-PlatingImpurityBismuth (Bi)7440-69-90.0000040.0010000.000066
Post-Plating Total0.370000100.0000006.598407
WirePure metalCopper (Cu)7440-50-80.01945299.9900000.346902
WireImpurityNon hazardous0.0000020.0100000.000031
Wire Total0.019454100.0000000.346933
74LVC1G3157GW Total5.607414100.000000100.000000
Notes
Report created on 2024-10-26 17:42:53 CEST+0200
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.
Pb-free Soldering Pb Soldering No. of Processing Cycles
PPT MPPT PPT MPPT
260 °C40 s235 °C30 s3
Notes
Report created on 2024-10-26 17:42:53 CEST+0200
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.
部件名称
Material
有毒或有害物质和元素 (Toxic or hazardous substances and elements)
铅 (Pb) 镉 (Cd) 汞 (Hg) 六价铬 (Cr6+) 多溴联苯 (PBB) 多溴二苯醚 (PBDE)
胶黏剂 (Adhesive)
半导体芯片 (Die)
引线框架 (Lead Frame)
模封料 (Mould Compound)
后镀层 (Post-Plating)
导线 (Wire)
表示该有害物质在该部件所有均质材料中的含量均在 GB/T 26572 规定的限量要求以下
Indicates that said hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement of GB/T 26572.
表示该有害物质至少在该部件的某一均质材料中的含量超出 GB/T 26572 规定的限量要求
Indicates that said hazardous substance contained in at least one of the homogeneous materials used for this part is above the limit requirement of GB/T 26572.
  该半导体产品具有无限期的环保使用期限(EFUP)。
This semiconductor product has an indefinite environmental friendly use period (EFUP).
Notes
Report created on 2024-10-26 17:42:53 CEST+0200
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.