Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BC856BMB

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

12NC OPN Type No. Package State MSL
934069543315BC856BMBYLBC856BMBSOT883B (XQFN3)RFS1
REACHCompliant with Regulation 1907/2006/EC (REACH). Does not contain REACH SVHC substances exceeding 1000 ppm of the article.
EU RoHSCompliant with Directive 2011/65/EU, amended by Directive 2015/863/EU, on the restriction of the use of certain hazardous substances in electrical and electronic equipment ('RoHS 2 amended') without exemptions.
CN RoHSCompliant with Chinese Administration on the Control of Pollution Caused by Electronic Information Products (ACPEIP; CN RoHS).
ELVCompliant with Directive 2000/53/EC, amended by Directive 2023/533, on end of life vehicles (ELV) without exemptions.
PFASDoes not contain any intentionally added per- and polyfluoroalkyl substances (PFAS).
CA Proposition 65Contains California Proposition 65 substance(s) [at the article level]: substance 7440-02-0: 33782 ppm; substance 1333-86-4: 2352 ppm; substance 7439-92-1: 1 ppm;
IEC 62474Contains IEC 62474 substance(s) [at the article level]: substance 7440-02-0: 33782 ppm; substance 1333-86-4: 2352 ppm; substance 7439-92-1: 1 ppm;
Precious MetalsContains precious metals [Ag, Au, Pd, Pt; at the article level]: substance 7440-22-4: 4799 ppm; substance 7440-05-3: 1255 ppm; substance 7440-57-5: 8915 ppm;
RHF IndicatorLead-free and halogen-free according to Nexperia's halogen-free definition.
RHF-2006 indicator DEU/CN RoHS compliantHalogen-free
Material Material Group Substance CAS No. Mass (mg) Material (%) Product (%)
AdhesiveFillerSilver (Ag)7440-22-40.00304076.0000000.479928
AdhesivePolymerPhenolic resin0.00054113.5300000.085440
AdhesivePolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.00041910.4700000.066115
Adhesive Total0.004000100.0000000.631483
DieDoped siliconSilicon (Si)7440-21-30.030000100.0000004.736127
Die Total0.030000100.0000004.736127
Lead FrameCopper alloyCopper (Cu)7440-50-80.24942291.03000039.376505
Lead FrameCopper alloyNickel (Ni)7440-02-00.0077822.8400001.228488
Lead FrameCopper alloySilicon (Si)7440-21-30.0016990.6200000.268191
Lead FrameCopper alloyMagnesium (Mg)7439-95-40.0004660.1700000.073536
Lead FramePure metal layerNickel (Ni)7440-02-00.0136174.9700002.149855
Lead FramePure metal layerPalladium (Pd)7440-05-30.0007950.2900000.125444
Lead FramePure metal layerGold (Au)7440-57-50.0002190.0800000.034605
Lead Frame Total0.274000100.00000043.256624
Mould CompoundFillerSilica fused60676-86-00.17880060.00000028.227314
Mould CompoundFillerSilica -amorphous-7631-86-90.06854023.00000010.820470
Mould CompoundPolymerEpoxy resin system0.0208607.0000003.293187
Mould CompoundPolymerPhenolic resin0.0178806.0000002.822732
Mould CompoundFlame retardantAluminium Hydroxide (Al(OH)3)21645-51-20.0089403.0000001.411366
Mould CompoundPigmentCarbon black1333-86-40.0014900.5000000.235228
Mould CompoundIon trapping agentBismuth (Bi)7440-69-90.0014900.5000000.235228
Mould Compound Total0.298000100.00000047.045525
Post-PlatingTin solderTin (Sn)7440-31-50.02198799.9400003.471076
Post-PlatingImpurityNon hazardous0.0000120.0555000.001928
Post-PlatingImpurityLead (Pb)7439-92-10.0000010.0045000.000156
Post-Plating Total0.022000100.0000003.473160
WirePure metalGold (Au)7440-57-50.00542899.9900000.856995
WireImpurityNon hazardous0.0000010.0100000.000086
Wire Total0.005429100.0000000.857081
BC856BMB Total0.633429100.000000100.000000
Notes
Report created on 2024-10-26 17:44:21 CEST+0200
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.
Pb-free Soldering Pb Soldering No. of Processing Cycles
PPT MPPT PPT MPPT
260 °C40 s235 °C30 s3
Notes
Report created on 2024-10-26 17:44:21 CEST+0200
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.
部件名称
Material
有毒或有害物质和元素 (Toxic or hazardous substances and elements)
铅 (Pb) 镉 (Cd) 汞 (Hg) 六价铬 (Cr6+) 多溴联苯 (PBB) 多溴二苯醚 (PBDE)
胶黏剂 (Adhesive)
半导体芯片 (Die)
引线框架 (Lead Frame)
模封料 (Mould Compound)
后镀层 (Post-Plating)
导线 (Wire)
表示该有害物质在该部件所有均质材料中的含量均在 GB/T 26572 规定的限量要求以下
Indicates that said hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement of GB/T 26572.
表示该有害物质至少在该部件的某一均质材料中的含量超出 GB/T 26572 规定的限量要求
Indicates that said hazardous substance contained in at least one of the homogeneous materials used for this part is above the limit requirement of GB/T 26572.
  该半导体产品具有无限期的环保使用期限(EFUP)。
This semiconductor product has an indefinite environmental friendly use period (EFUP).
Notes
Report created on 2024-10-26 17:44:21 CEST+0200
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.