Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BUK762R4-60E

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

12NC OPN Type No. Package State MSL
934066496118BUK762R4-60E,118BUK762R4-60ESOT404 (D2PAK)RFS1
REACHCompliant with Regulation 1907/2006/EC (REACH). Contains REACH SVHC substance 7439-92-1 at 7725 ppm of the article. SCIP No. f418fbbb-02c3-4537-b339-5fe68689b4f8.
EU RoHSCompliant with Directive 2011/65/EU, amended by Directive 2015/863/EU, on the restriction of the use of certain hazardous substances in electrical and electronic equipment ('RoHS 2 amended'); using exemption 7(a): 'Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead).'.
CN RoHSNot compliant with Chinese ACPEIP (Administration on the Control of Pollution Caused by Electronic Information Products) (CN RoHS).
ELVCompliant with Directive 2000/53/EC, amended by Directive 2023/533, on end of life vehicles (ELV); using exemption 8(e): 'Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead).'.
PFASDoes not contain any intentionally added per- and polyfluoroalkyl substances (PFAS).
CA Proposition 65Contains California Proposition 65 substance(s) [at the article level]: substance 7439-92-1: 7725 ppm; substance 7440-02-0: 3940 ppm; substance 1309-64-4: 7054 ppm; substance 1333-86-4: 783 ppm;
IEC 62474Contains IEC 62474 substance(s) [at the article level]: substance 7439-92-1: 7725 ppm; substance 7440-02-0: 3940 ppm; substance 1309-64-4: 7054 ppm; substance 40039-93-8: 5878 ppm; substance 1333-86-4: 783 ppm;
Precious MetalsContains precious metals [Ag, Au, Pd, Pt; at the article level]: substance 7440-22-4: 124 ppm;
RHF IndicatorContains EU RoHS-exempted lead and halogens according to Nexperia's halogen-free definition.
RHF-2006 indicator E
Material Material Group Substance CAS No. Mass (mg) Material (%) Product (%)
Solder WireLead alloyLead (Pb)7439-92-111.24664893.5000000.772589
Solder WireLead alloyTin (Sn)7440-31-50.6014255.0000000.041315
Solder WireLead alloySilver (Ag)7440-22-40.1804271.5000000.012394
Solder Wire Total12.028500100.0000000.826298
DieDoped siliconSilicon (Si)7440-21-39.800000100.0000000.673211
Die Total9.800000100.0000000.673211
Lead FrameCopper alloyCopper (Cu)7440-50-8822.50997998.97000056.502325
Lead FrameCopper alloyNickel (Ni)7440-02-05.7343830.6900000.393923
Lead FrameCopper alloyPhosphorus (P)7723-14-01.9945680.2400000.137017
Lead FrameCopper alloyIron (Fe)7439-89-60.8310700.1000000.057090
Lead Frame Total831.070000100.00000057.090355
Mould CompoundFillerSilica fused60676-86-0427.89000075.00000029.393905
Mould CompoundPolymerEpoxy resin system81.77451414.3333305.617500
Mould CompoundPolymerPhenolic resin40.8872867.1666702.808752
Mould CompoundFlame retardantAntimony Trioxide (Sb2O3)1309-64-410.2693601.8000000.705454
Mould CompoundFlame retardantTetrabromobisphenol A/Epichlorohydrin polymer40039-93-88.5578001.5000000.587878
Mould CompoundPigmentCarbon black1333-86-41.1410400.2000000.078384
Mould Compound Total570.520000100.00000039.191873
Post-PlatingTin alloyTin (Sn)7440-31-519.78802199.9900001.359338
Post-PlatingImpurityNon hazardous0.0019790.0100000.000136
Post-Plating Total19.790000100.0000001.359474
Wire 1Pure metalAluminium (Al)7429-90-512.24512599.9900000.841179
Wire 1Pure metalNickel (Ni)7440-02-00.0012250.0100000.000084
Wire Total12.246350100.0000000.841263
Wire 1 Total12.246350100.0000000.841263
Wire 2Pure metalAluminium (Al)7429-90-50.25510699.9900000.017524
Wire 2ImpurityNon hazardous0.0000260.0100000.000002
Wire Total0.255132100.0000000.017526
Wire 2 Total0.255132100.0000000.017526
BUK762R4-60E Total1455.709982100.000000100.000000
Notes
Report created on 2024-10-26 17:44:55 CEST+0200
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.
Pb-free Soldering Pb Soldering No. of Processing Cycles
PPT MPPT PPT MPPT
245 °C40 s220 °C30 s3
Notes
Report created on 2024-10-26 17:44:55 CEST+0200
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.
部件名称
Material
有毒或有害物质和元素 (Toxic or hazardous substances and elements)
铅 (Pb) 镉 (Cd) 汞 (Hg) 六价铬 (Cr6+) 多溴联苯 (PBB) 多溴二苯醚 (PBDE)
焊锡丝 (Solder Wire)
半导体芯片 (Die)
引线框架 (Lead Frame)
模封料 (Mould Compound)
后镀层 (Post-Plating)
导线1 (Wire 1)
导线2 (Wire 2)
表示该有害物质在该部件所有均质材料中的含量均在 GB/T 26572 规定的限量要求以下
Indicates that said hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement of GB/T 26572.
表示该有害物质至少在该部件的某一均质材料中的含量超出 GB/T 26572 规定的限量要求
Indicates that said hazardous substance contained in at least one of the homogeneous materials used for this part is above the limit requirement of GB/T 26572.
  该半导体产品具有无限期的环保使用期限(EFUP)。
This semiconductor product has an indefinite environmental friendly use period (EFUP).
Notes
Report created on 2024-10-26 17:44:55 CEST+0200
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.