Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BUK9M9R1-40E

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BUK9M9R1-40ESOT1210mLFPAK37.820000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340700821151126030 s126020 s3Leaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-31.400000100.0000003.701745
subTotal1.400000100.0000003.701745
ClipCopper alloyCopper (Cu)7440-50-85.68860099.80000015.041248
Iron (Fe)7439-89-60.0085500.1500000.022607
Phosphorus (P)7723-14-00.0028500.0500000.007536
subTotal5.700000100.00000015.071391
Lead FrameCopper alloyCopper (Cu)7440-50-813.87220099.80000036.679535
Iron (Fe)7439-89-60.0208500.1500000.055130
Phosphorus (P)7723-14-00.0069500.0500000.018377
subTotal13.900000100.00000036.753041
Mould CompoundFillerSilica fused60676-86-05.28860062.00000013.983607
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-21.32215015.5000003.495902
ImpuritySilicon Dioxide (SiO2)14808-60-70.0170600.2000000.045108
PigmentCarbon black1333-86-40.0426500.5000000.112771
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-70.1706002.0000000.451084
Epichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.93830011.0000002.480962
Phenolic resinProprietary0.7506408.8000001.984770
subTotal8.530000100.00000022.554204
Post-PlatingImpurityNon hazardousProprietary0.0003850.0100000.001018
Tin alloyTin (Sn)7440-31-53.84961599.99000010.178781
subTotal3.850000100.00000010.179799
Solder PasteLead alloyLead (Pb)7439-92-14.10700092.50000010.859334
Silver (Ag)7440-22-40.1110002.5000000.293496
Tin (Sn)7440-31-50.2220005.0000000.586991
subTotal4.440000100.00000011.739820
total37.820000100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.