Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PBSS5160PAP

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

12NC OPN Type No. Package State MSL
934066887115PBSS5160PAP,115PBSS5160PAPSOT1118 (HUSON6)RFS1
REACHCompliant with Regulation 1907/2006/EC (REACH). Does not contain REACH SVHC substances exceeding 1000 ppm of the article.
EU RoHSCompliant with Directive 2011/65/EU, amended by Directive 2015/863/EU, on the restriction of the use of certain hazardous substances in electrical and electronic equipment ('RoHS 2 amended') without exemptions.
CN RoHSCompliant with Chinese Administration on the Control of Pollution Caused by Electronic Information Products (ACPEIP; CN RoHS).
ELVCompliant with Directive 2000/53/EC, amended by Directive 2023/533, on end of life vehicles (ELV) without exemptions.
PFASDoes not contain any intentionally added per- and polyfluoroalkyl substances (PFAS).
CA Proposition 65Contains California Proposition 65 substance(s) [at the article level]: substance 7440-02-0: 14849 ppm; substance 1333-86-4: 1042 ppm; substance 7439-92-1: <1 ppm;
IEC 62474Contains IEC 62474 substance(s) [at the article level]: substance 7440-02-0: 14849 ppm; substance 1333-86-4: 1042 ppm; substance 7439-92-1: <1 ppm;
Precious MetalsContains precious metals [Ag, Au, Pd, Pt; at the article level]: substance 7440-22-4: 8807 ppm; substance 7440-05-3: 266 ppm; substance 7440-57-5: 76 ppm;
RHF IndicatorLead-free and halogen-free according to Nexperia's halogen-free definition.
RHF-2006 indicator DEU/CN RoHS compliantHalogen-free
Material Material Group Substance CAS No. Mass (mg) Material (%) Product (%)
AdhesiveFillerSilver (Ag)7440-22-40.06240080.0000000.880678
AdhesivePolymerAcrylic resin0.01560020.0000000.220170
Adhesive Total0.078000100.0000001.100848
DieDoped siliconSilicon (Si)7440-21-30.240000100.0000003.387224
Die Total0.240000100.0000003.387224
Lead FrameCopper alloyCopper (Cu)7440-50-82.55941095.11000036.122066
Lead FrameCopper alloyNickel (Ni)7440-02-00.0853053.1700001.203942
Lead FrameCopper alloySilicon (Si)7440-21-30.0185680.6900000.262057
Lead FrameCopper alloyMagnesium (Mg)7439-95-40.0053820.2000000.075958
Lead FramePure metal layerNickel (Ni)7440-02-00.0199130.7400000.281046
Lead FramePure metal layerPalladium (Pd)7440-05-30.0018840.0700000.026585
Lead FramePure metal layerGold (Au)7440-57-50.0005380.0200000.007596
Lead Frame Total2.691000100.00000037.979250
Mould CompoundFillerSilica fused60676-86-03.34951286.15000047.273115
Mould CompoundPolymerEpoxy resin system0.3370908.6700004.757492
Mould CompoundHardenerPhenolic resin0.1667954.2900002.354053
Mould CompoundAdditiveNon hazardous0.0159410.4100000.224979
Mould CompoundFillerSilica -amorphous-7631-86-90.0112750.2900000.159132
Mould CompoundPigmentCarbon black1333-86-40.0073870.1900000.104259
Mould Compound Total3.888000100.00000054.873030
Post-PlatingTin solderTin (Sn)7440-31-50.16390299.9400002.313214
Post-PlatingImpurityNon hazardous0.0000910.0555000.001285
Post-PlatingImpurityLead (Pb)7439-92-10.0000070.0045000.000104
Post-Plating Total0.164000100.0000002.314603
WirePure metalCopper (Cu)7440-50-80.02444699.9900000.345010
WireImpurityNon hazardous0.0000020.0100000.000035
Wire Total0.024448100.0000000.345045
PBSS5160PAP Total7.085448100.000000100.000000
Notes
Report created on 2024-10-26 17:49:44 CEST+0200
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.
Pb-free Soldering Pb Soldering No. of Processing Cycles
PPT MPPT PPT MPPT
260 °C40 s235 °C30 s3
Notes
Report created on 2024-10-26 17:49:44 CEST+0200
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.
部件名称
Material
有毒或有害物质和元素 (Toxic or hazardous substances and elements)
铅 (Pb) 镉 (Cd) 汞 (Hg) 六价铬 (Cr6+) 多溴联苯 (PBB) 多溴二苯醚 (PBDE)
胶黏剂 (Adhesive)
半导体芯片 (Die)
引线框架 (Lead Frame)
模封料 (Mould Compound)
后镀层 (Post-Plating)
导线 (Wire)
表示该有害物质在该部件所有均质材料中的含量均在 GB/T 26572 规定的限量要求以下
Indicates that said hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement of GB/T 26572.
表示该有害物质至少在该部件的某一均质材料中的含量超出 GB/T 26572 规定的限量要求
Indicates that said hazardous substance contained in at least one of the homogeneous materials used for this part is above the limit requirement of GB/T 26572.
  该半导体产品具有无限期的环保使用期限(EFUP)。
This semiconductor product has an indefinite environmental friendly use period (EFUP).
Notes
Report created on 2024-10-26 17:49:44 CEST+0200
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.