Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PMH550UNE

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

12NC OPN Type No. Package State MSL
934660491125PMH550UNEHPMH550UNESOT8001 (DFN0606-3)RFS1
REACHCompliant with Regulation 1907/2006/EC (REACH). Does not contain REACH SVHC substances exceeding 1000 ppm of the article.
EU RoHSCompliant with Directive 2011/65/EU, amended by Directive 2015/863/EU, on the restriction of the use of certain hazardous substances in electrical and electronic equipment ('RoHS 2 amended') without exemptions.
CN RoHSCompliant with Chinese Administration on the Control of Pollution Caused by Electronic Information Products (ACPEIP; CN RoHS).
ELVCompliant with Directive 2000/53/EC, amended by Directive 2023/533, on end of life vehicles (ELV) without exemptions.
PFASDoes not contain any intentionally added per- and polyfluoroalkyl substances (PFAS).
CA Proposition 65Contains California Proposition 65 substance(s) [at the article level]: substance 7440-02-0: 22523 ppm; substance 1333-86-4: 2367 ppm;
IEC 62474Contains IEC 62474 substance(s) [at the article level]: substance 7440-02-0: 22523 ppm; substance 1333-86-4: 2367 ppm;
Precious MetalsContains precious metals [Ag, Au, Pd, Pt; at the article level]: substance 7440-22-4: 8332 ppm; substance 7440-05-3: 754 ppm; substance 7440-57-5: 13609 ppm;
RHF IndicatorLead-free and halogen-free according to Nexperia's halogen-free definition.
RHF-2006 indicator DEU/CN RoHS compliantHalogen-free
Material Material Group Substance CAS No. Mass (mg) Material (%) Product (%)
AdhesiveFillerSilver (Ag)7440-22-40.00380076.0000000.833151
AdhesivePolymerPhenolic resin0.00067713.5300000.148323
AdhesivePolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.00052310.4700000.114777
Adhesive Total0.005000100.0000001.096251
DieDoped siliconSilicon (Si)7440-21-30.040000100.0000008.770007
Die Total0.040000100.0000008.770007
Lead FrameCopper alloyCopper (Cu)7440-50-80.17680493.54730038.764393
Lead FrameCopper alloyNickel (Ni)7440-02-00.0055142.9173001.208879
Lead FrameCopper alloySilicon (Si)7440-21-30.0011950.6321000.261931
Lead FrameCopper alloyMagnesium (Mg)7439-95-40.0002760.1459000.060458
Lead FramePure metal layerNickel (Ni)7440-02-00.0047592.5181001.043457
Lead FramePure metal layerPalladium (Pd)7440-05-30.0003440.1818000.075335
Lead FramePure metal layerGold (Au)7440-57-50.0001080.0575000.023828
Lead Frame Total0.189000100.00000041.438281
Mould CompoundFillerSilica fused60676-86-00.12960060.00000028.414822
Mould CompoundFillerSilica -amorphous-7631-86-90.04968023.00000010.892348
Mould CompoundPolymerEpoxy resin system0.0151207.0000003.315062
Mould CompoundPolymerPhenolic resin0.0129606.0000002.841482
Mould CompoundFlame retardantAluminium Hydroxide (Al(OH)3)21645-51-20.0064803.0000001.420741
Mould CompoundPigmentCarbon black1333-86-40.0010800.5000000.236790
Mould CompoundIon trapping agentBismuth (Bi)7440-69-90.0010800.5000000.236790
Mould Compound Total0.216000100.00000047.358035
WirePure metalGold (Au)7440-57-50.00609999.9900001.337292
WireImpurityNon hazardous0.0000010.0100000.000134
Wire Total0.006100100.0000001.337426
PMH550UNE Total0.456100100.000000100.000000
Notes
Report created on 2024-10-26 17:51:50 CEST+0200
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.
Pb-free Soldering Pb Soldering No. of Processing Cycles
PPT MPPT PPT MPPT
260 °C40 s235 °C30 s3
Notes
Report created on 2024-10-26 17:51:50 CEST+0200
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.
部件名称
Material
有毒或有害物质和元素 (Toxic or hazardous substances and elements)
铅 (Pb) 镉 (Cd) 汞 (Hg) 六价铬 (Cr6+) 多溴联苯 (PBB) 多溴二苯醚 (PBDE)
胶黏剂 (Adhesive)
半导体芯片 (Die)
引线框架 (Lead Frame)
模封料 (Mould Compound)
导线 (Wire)
表示该有害物质在该部件所有均质材料中的含量均在 GB/T 26572 规定的限量要求以下
Indicates that said hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement of GB/T 26572.
表示该有害物质至少在该部件的某一均质材料中的含量超出 GB/T 26572 规定的限量要求
Indicates that said hazardous substance contained in at least one of the homogeneous materials used for this part is above the limit requirement of GB/T 26572.
  该半导体产品具有无限期的环保使用期限(EFUP)。
This semiconductor product has an indefinite environmental friendly use period (EFUP).
Notes
Report created on 2024-10-26 17:51:50 CEST+0200
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.