BSP60; BSP61; BSP62
Parametrics
Type number | Package version | Package name | Size (mm) | channel type (e) | Configuration | Ptot (mW) | IC [max] (mA) | hFE [min] | hFE [min] | |||
---|---|---|---|---|---|---|---|---|---|---|---|---|
BSP60 | SOT223 | SC-73 | 6.5 x 3.5 x 1.65 | PNP | 2 | 1250.0 | -1000.0 | 2000.0 | 1000.0 | |||
BSP61 | SOT223 | SC-73 | 6.5 x 3.5 x 1.65 | PNP | 2 | 1250.0 | -1000.0 | 2000.0 | 1000.0 | |||
BSP62 | SOT223 | SC-73 | 6.5 x 3.5 x 1.65 | 2000 | 1500 | 200 | PNP | 500 | 80 | 1250 | >2000 | N |
BSP62-Q | SOT223 | SC-73 | 6.5 x 3.5 x 1.65 | 2000 | 1500 | PNP | 500 | 1250 | 80 | 200 | 2000 |
Package
Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
---|---|---|---|---|---|---|---|
BSP60 | BSP60,115 (933986350115) |
Active | BSP60 |
SC-73 (SOT223) |
SOT223 |
REFLOW_BG-BD-1
WAVE_BG-BD-1 |
SOT223_115 |
BSP61 | BSP61,115 (933986360115) |
Active | BSP61 |
SC-73 (SOT223) |
SOT223 |
REFLOW_BG-BD-1
WAVE_BG-BD-1 |
SOT223_115 |
BSP62 | BSP62,115 (933969480115) |
Active | BSP62 |
SC-73 (SOT223) |
SOT223 |
REFLOW_BG-BD-1
WAVE_BG-BD-1 |
SOT223_115 |
BSP62-Q | BSP62-QX (934664942115) |
Active | BSP62 |
SC-73 (SOT223) |
SOT223 |
REFLOW_BG-BD-1
WAVE_BG-BD-1 |
SOT223_115 |
Documentation (12)
File name | Title | Type | Date |
---|---|---|---|
BSP60 | PNP Darlington transistor | Data sheet | 2018-05-02 |
mgd624 | Block diagram: BSP60, BSP61, BSP62, PMST2907A | Block diagram | 2009-11-03 |
SOT223 | 3D model for products with SOT223 package | Design support | 2019-01-22 |
75017516 | NXP secure microcontroller family SmartMX2 | Leaflet | 2014-03-23 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
SC-73_SOT223_mk | plastic, surface-mounted package with increased heatsink; 4 leads; 4.6 mm pitch; 6.5 mm x 3.5 mm x 1.65 mm body | Marcom graphics | 2017-01-28 |
DERATSMD | Power Derating Curves for SMDs; General | Other type | 1999-05-06 |
LSYMTRA | Letter Symbols - Transistors; General | Other type | 1999-05-06 |
SOT223 | plastic, surface-mounted package with increased heatsink; 4 leads; 2.3 mm pitch; 6.5 mm x 3.5 mm x 1.65 mm body | Package information | 2022-05-30 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
Support
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Models
File name | Title | Type | Date |
---|---|---|---|
SOT223 | 3D model for products with SOT223 package | Design support | 2019-01-22 |
Sample
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