PCMFxHDMI2S
Parametrics
Type number | Package version | Package name | Size (mm) | Configuration | Nr of lines | VRWM (V) (V) | Cd [typ] (pF) | IPPM [max] (A) | VESD (kV) (kV) |
---|---|---|---|---|---|---|---|---|---|
PCMF1HDMI2S | WLCSP5_2-1-2 | WLCSP5 | 0.77 x 1.17 x 0.57 | Unidirectional | 1 | 5 | 0.25 | 7 | 15 |
PCMF2HDMI2S | WLCSP10_4-2-4 | WLCSP10 | 1.57 x 1.17 x 0.57 | Unidirectional | 2 | 5 | 0.25 | 7 | 15 |
PCMF3HDMI2S | WLCSP15_6-3-6 | WLCSP15 | 2.37 x 1.17 x 0.57 | Unidirectional | 3 | 5 | 0.25 | 7 | 15 |
Package
Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
---|---|---|---|---|---|---|---|
PCMF1HDMI2S | PCMF1HDMI2SZ (934070092087) |
Active | P "with circle" |
WLCSP5 (WLCSP5_2-1-2) |
WLCSP5_2-1-2 | Not available | |
PCMF2HDMI2S | PCMF2HDMI2SZ (934070093087) |
Active | P with circle |
WLCSP10 (WLCSP10_4-2-4) |
WLCSP10_4-2-4 | WLCSP10_PCMF_PESD2USB3X_PCMF2HDMI2X_087 | |
PCMF3HDMI2S | PCMF3HDMI2SZ (934070094087) |
Active | P with circle |
WLCSP15 (WLCSP15_6-3-6) |
WLCSP15_6-3-6 | WLCSP15_PCMF_PESD3USB3X_PCMF3HDMI2X_087 |
Environmental information
Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
---|---|---|---|---|
PCMF1HDMI2S | PCMF1HDMI2SZ | PCMF1HDMI2S | ||
PCMF2HDMI2S | PCMF2HDMI2SZ | PCMF2HDMI2S | ||
PCMF3HDMI2S | PCMF3HDMI2SZ | PCMF3HDMI2S |
Documentation (10)
File name | Title | Type | Date |
---|---|---|---|
PCMFXHDMI2S_SER | Common-mode EMI filter for differential channels with integrated ESD protection | Data sheet | 2017-05-04 |
WLCSP5_2-1-2 | 3D model for products with WLCSP5_2-1-2 package | Design support | 2023-03-13 |
WLCSP10_4-2-4 | 3D model for products with WLCSP10_4-2-4 package | Design support | 2023-03-13 |
WLCSP15_6-3-6 | 3D model for products with WLCSP15_6-3-6 package | Design support | 2023-03-13 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
WLCSP5_2-1-2_mk | wafer level chip-size package; 5 bumps (2-1-2) | Marcom graphics | 2017-01-28 |
WLCSP10_4-2-4_mk | wafer level chip-size package; 10 bumps (4-2-4) | Marcom graphics | 2017-01-28 |
WLCSP5_2-1-2 | wafer level chip-size package; 5 bumps (2-1-2); 0.4 mm pitch; 0.77 x 1.17 x 0.57 mm body | Package information | 2020-04-21 |
WLCSP10_4-2-4 | wafer level chip-size package; 10 bumps (4-2-4); 0.4 mm pitch; 1.57 x 1.17 x 0.57 mm body | Package information | 2020-04-21 |
WLCSP15_6-3-6 | wafer level chip-size package; 15 bumps (6-3-6); 0.4 mm pitch; 2.37 x 1.17 x 0.57 mm body | Package information | 2020-04-21 |
Support
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Models
File name | Title | Type | Date |
---|---|---|---|
WLCSP5_2-1-2 | 3D model for products with WLCSP5_2-1-2 package | Design support | 2023-03-13 |
WLCSP10_4-2-4 | 3D model for products with WLCSP10_4-2-4 package | Design support | 2023-03-13 |
WLCSP15_6-3-6 | 3D model for products with WLCSP15_6-3-6 package | Design support | 2023-03-13 |
Ordering, pricing & availability
Sample
As a Nexperia customer you can order samples via our sales organization.
If you do not have a direct account with Nexperia our network of global and regional distributors is available and equipped to support you with Nexperia samples. Check out the list of official distributors.