74LV07AT
Parametrics
Type number | VCC (V) | Logic switching levels | Output drive capability (mA) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Package name |
---|---|---|---|---|---|---|---|---|
74LV07ATPW | 4.5 - 5.5 | TTL | ± 12 | 60 | 6 | low | -40~125 | TSSOP14 |
Package
Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
---|---|---|---|---|---|---|---|
74LV07ATPW | 74LV07ATPWJ (935308209118) |
Active | LV07AT |
TSSOP14 (SOT402-1) |
SOT402-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT402-1_118 |
Environmental information
Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
---|---|---|---|---|
74LV07ATPW | 74LV07ATPWJ | 74LV07ATPW |
Documentation (8)
File name | Title | Type | Date |
---|---|---|---|
74LV07AT | Hex buffer with open-drain outputs | Data sheet | 2024-04-08 |
SOT402-1 | 3D model for products with SOT402-1 package | Design support | 2023-02-02 |
lv07at | lv07at IBIS model | IBIS model | 2017-06-02 |
Nexperia_document_leaflet_Logic_LV-AT_201903 | LV-A(T) logic family | Leaflet | 2019-03-19 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
TSSOP14_SOT402-1_mk | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
SOT402-1 | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.2 mm body | Package information | 2023-11-07 |
SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
Support
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Ordering, pricing & availability
Sample
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