Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

74LVC574A-Q100

Parametrics

Type number VCC (V) Logic switching levels Output drive capability (mA) tpd (ns) fmax (MHz) Power dissipation considerations Tamb (°C) Package name
74LVC574ABQ-Q100 1.2 - 3.6 CMOS/LVTTL ± 24 3.2 150 low -40~125 DHVQFN20
74LVC574APW-Q100 1.2 - 3.6 CMOS/LVTTL ± 24 3.2 150 low -40~125 TSSOP20

Package

Type number Orderable part number, (Ordering code (12NC)) Status Marking Package Package information Reflow-/Wave soldering Packing
74LVC574ABQ-Q100 74LVC574ABQ-Q100X
(935691607115)
Active LVC574A SOT764-1
DHVQFN20
(SOT764-1)
SOT764-1 SOT764-1_115
74LVC574APW-Q100 74LVC574APW-Q100J
(935691608118)
Active LVC574A SOT360-1
TSSOP20
(SOT360-1)
SOT360-1 SSOP-TSSOP-VSO-WAVE
SOT360-1_118

Environmental information

Type number Orderable part number Chemical content RoHS RHF-indicator
74LVC574ABQ-Q100 74LVC574ABQ-Q100X 74LVC574ABQ-Q100 rohs rhf rhf
74LVC574APW-Q100 74LVC574APW-Q100J 74LVC574APW-Q100 rohs rhf rhf
Quality and reliability disclaimer

Documentation (9)

File name Title Type Date
74LVC574A_Q100 Octal D-type flip-flop with 5 V tolerant inputs/outputs; positive edge-trigger; 3-state Data sheet 2023-11-02
SOT764-1 3D model for products with SOT764-1 package Design support 2019-10-03
SOT360-1 3D model for products with SOT360-1 package Design support 2020-01-22
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
DHVQFN20_SOT764-1_mk plastic, dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 2.5 mm x 4.5 mm x 0.85 mm body Marcom graphics 2017-01-28
TSSOP20_SOT360-1_mk plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.1 mm body Marcom graphics 2017-01-28
SOT764-1 plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 4.5 mm x 2.5 mm x 1 mm body Package information 2022-06-21
SOT360-1 plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.1 mm body Package information 2022-06-21
SSOP-TSSOP-VSO-WAVE Footprint for wave soldering Wave soldering 2009-10-08

Support

If you are in need of design/technical support, let us know and fill in the answer form we'll get back to you shortly.

Models

File name Title Type Date
SOT764-1 3D model for products with SOT764-1 package Design support 2019-10-03
SOT360-1 3D model for products with SOT360-1 package Design support 2020-01-22

Ordering, pricing & availability

Sample

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If you do not have a direct account with Nexperia our network of global and regional distributors is available and equipped to support you with Nexperia samples. Check out the list of official distributors.