Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

SOT8019-1

SOT8019-1

wafer level chip-scale package, 12 bumps; 1.36 x 1.86 x 0.60 mm

Package information

Package information Package name Package description Reference Date
SOT8019-1 WLCSP12 wafer level chip-scale package, 12 bumps; 1.36 x 1.86 x 0.60 mm 2020-08-12

Related documents

File name Title Type Date
AN90032 Low temperature soldering, application study Application note 2022-02-22
SOT8019-1 3D model for products with SOT8019-1 package Design support 2023-02-07
SOT8019-1 wafer level chip-scale package, 12 bumps; 1.36 x 1.86 x 0.60 mm Package information 2022-02-11
SOT8019-1_336 WLCSP12; Reel dry pack for SMD, 7"; Q1/T1 product orientation Packing information 2023-03-03

Products in this package

Analog & Logic ICs

Type number Description Quick access
NXS0104UM Dual supply translating transceiver; open drain; auto direction sensing