Package information
Package information | Package name | Package description | Reference | Date |
---|---|---|---|---|
WLCSP5_2-1-2 | WLCSP5 | wafer level chip-size package; 5 bumps (2-1-2); 0.4 mm pitch; 0.77 x 1.17 x 0.57 mm body | 2010-02-11 |
Related documents
File name | Title | Type | Date |
---|---|---|---|
WLCSP5_2-1-2 | 3D model for products with WLCSP5_2-1-2 package | Design support | 2023-03-13 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
WLCSP5_2-1-2_mk | wafer level chip-size package; 5 bumps (2-1-2) | Marcom graphics | 2017-01-28 |
WLCSP5_2-1-2 | wafer level chip-size package; 5 bumps (2-1-2); 0.4 mm pitch; 0.77 x 1.17 x 0.57 mm body | Package information | 2020-04-21 |
Products in this package
ESD protection, TVS, filtering and signal conditioning
Type number | Description | Quick access |
---|---|---|
PCMF1HDMI14S | Common-mode EMI filter for differential channels with integrated ESD protection | |
PCMF1USB30 | Common-mode EMI filter for differential channels with integrated ESD protection | |
PCMF1USB3BA | Common-mode EMI filter for differential channels with integrated bidirectional ESD protection | |
PCMF1HDMI2S | Common-mode EMI filter for differential channels with integrated ESD protection | |
PESD1USB30 | ESD protection for differential data lines | |
PCMF1USB3S | Common-mode EMI filter for differential channels with integrated ESD protection | |
PCMF1USB3B | Common-mode EMI filter for differential channels with integrated bidirectional ESD protection | |
PESD1USB3B | ESD protection for differential data lines | |
PESD1USB3S | ESD protection for differential data lines |