NXB0101
Parametrics
| Type number | VCC(A) (V) | VCC(B) (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | Nr of bits | Power dissipation considerations | Tamb (°C) | Package name | Category |
|---|---|---|---|---|---|---|---|---|---|---|
| NXB0101GM | 1.2 - 3.6 | 1.65 - 5.5 | CMOS | ± 0.02 | 5.5 | 1 | low | -40~125 | XSON6 | Bi-directional | AutoSense |
| NXB0101GS | 1.2 - 3.6 | 1.65 - 5.5 | CMOS | ± 0.02 | 5.5 | 1 | low | -40~125 | XSON6 | Bi-directional | AutoSense |
| NXB0101GW | 1.2 - 3.6 | 1.65 - 5.5 | CMOS | ± 0.02 | 5.5 | 1 | low | -40~125 | TSSOP6 | Bi-directional | AutoSense |
Package
| Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
|---|---|---|---|---|---|---|---|
| NXB0101GM | NXB0101GMX (935289726115) |
Active | n1 |
XSON6 (SOT886) |
SOT886 |
REFLOW_BG-BD-1
|
SOT886_115 |
| NXB0101GS | NXB0101GSH (935690917125) |
Active | n1 |
XSON6 (SOT1202) |
SOT1202 |
REFLOW_BG-BD-1
|
Not available |
| NXB0101GW | NXB0101GWH (935289728125) |
Active | n1 |
TSSOP6 (SOT363-2) |
SOT363-2 | SOT363-2_125 |
Documentation (15)
| File name | Title | Type | Date |
|---|---|---|---|
| NXB0101 | Dual supply translating transceiver; auto direction sensing; 3-state | Data sheet | 2023-11-15 |
| Nexperia_document_guide_MiniLogic_MicroPak_201808 | MicroPak leadless logic portfolio guide | Brochure | 2018-09-03 |
| SOT886 | 3D model for products with SOT886 package | Design support | 2019-10-03 |
| SOT1202 | 3D model for products with SOT1202 package | Design support | 2023-02-02 |
| SOT363-2 | 3D model for products with SOT363-2 package | Design support | 2023-02-02 |
| nxb0101 | NXB0101 IBIS model | IBIS model | 2020-02-26 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DFN1410-6_SOT886_mk | plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
| XSON6_SOT886_mk | plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
| SOT886 | plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Package information | 2022-06-01 |
| SOT1202 | plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm body | Package information | 2022-06-01 |
| SOT363-2 | plastic thin shrink small outline package; 6 leads; body width 1.25 mm | Package information | 2022-11-21 |
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
| MAR_SOT886 | MAR_SOT886 Topmark | Top marking | 2013-06-03 |
| MAR_SOT1202 | MAR_SOT1202 Topmark | Top marking | 2013-06-03 |
Support
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Models
| File name | Title | Type | Date |
|---|---|---|---|
| SOT886 | 3D model for products with SOT886 package | Design support | 2019-10-03 |
| SOT1202 | 3D model for products with SOT1202 package | Design support | 2023-02-02 |
| SOT363-2 | 3D model for products with SOT363-2 package | Design support | 2023-02-02 |
| nxb0101 | NXB0101 IBIS model | IBIS model | 2020-02-26 |
Sample
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