Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 74AVC4T3144GU12

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74AVC4T3144GU12SOT1174-1XQFN124.36995 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9356901741157126030 s123520 s3Bangkok, Thailand; Nijmegen, Netherlands; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilica -amorphous-7631-86-90.0173860.000000.39762
ImpurityNon hazardousProprietary0.000010.039500.00026
PolymerResin systemProprietary0.0115739.951410.26476
subTotal0.02896100.000000.66264
DieDoped siliconSilicon (Si)7440-21-30.15462100.000003.53823
subTotal0.15462100.000003.53823
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-82.1318697.0000048.78446
Nickel (Ni)7440-02-00.065933.000001.50880
subTotal2.19779100.0000050.29326
Mould CompoundAdditiveNon hazardousProprietary0.053572.984001.22580
FillerSilica -amorphous-7631-86-90.062653.490001.43366
Silica fused60676-86-01.5226484.8200034.84337
Flame retardantFlame retardant, organic phosphorus compoundProprietary0.017991.002000.41161
PigmentCarbon black1333-86-40.002940.164000.06737
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-70.066443.701001.52034
Epoxy resin systemProprietary0.028471.586000.65152
Phenolic resinProprietary0.040442.253000.92551
subTotal1.79514100.0000041.07918
Pre-PlatingPure metal layerGold (Au)7440-57-50.001181.000000.02703
Nickel (Ni)7440-02-00.1074891.000002.45953
Palladium (Pd)7440-05-30.009458.000000.21622
subTotal0.11811100.000002.70278
WirePure metalGold (Au)7440-57-50.0745899.000001.70672
Palladium (Pd)7440-05-30.000751.000000.01724
subTotal0.07534100.000001.72396
total4.36995100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.