Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

News and events

Harvard China College Forum Insight | Wing Zhang, Chairman of Nexperia, Shares Global Perspectives on AI-Era Opportunities
  • Press release
April 11, 2025

Harvard China College Forum Insight | Wing Zhang, ...

From April 4 to 6, the 28th Harvard China College Forum was successfully held. Wing Zhang, ...

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Nexperia introduces new high speed optimized flip-chip package technology for automotive ESD protection
  • Press release
April 09, 2025

Nexperia introduces new high speed optimized ...

New flip-chip land grid array (FC-LGA) packages deliver superior RF performance and ...

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Nexperia Chairman Wing Zhang’s Yale Summit Speech: Globalization Empowers Civilization
  • Press release
March 31, 2025

Nexperia Chairman Wing Zhang’s Yale Summit Speech: ...

On March 30, 2025, the 11th Yale China-U.S. Summit was held simultaneously at the main venue in ...

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March 29, 2025

Nexperia in the Spotlight at football match N.E.C. – AZ

Nexperia, a semiconductor manufacturer headquartered in Nijmegen, is the main partner of ...

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March 25, 2025

12-channel LED driver from Nexperia supports ASIL-B ...

Reduced heating enables higher integration in space-constrained environments

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Nexperia launches industry leading 1200 V SiC MOSFETs in top-side cooled X.PAK
  • Press release
March 19, 2025

Nexperia launches industry leading 1200 V SiC ...

New X.PAK packaging combines high thermal performance, compact size, and easy assembly for ...

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