74ALVC573
Parametrics
Type number | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | Power dissipation considerations | Tamb (°C) | Package name |
---|---|---|---|---|---|---|---|
74ALVC573BQ | 1.65 - 3.6 | LVTTL | ± 24 | 2.2 | low | -40~85 | DHVQFN20 |
74ALVC573D | 1.65 - 3.6 | LVTTL | ± 24 | 2.2 | low | -40~85 | SO20 |
74ALVC573PW | 1.65 - 3.6 | LVTTL | ± 24 | 2.2 | low | -40~85 | TSSOP20 |
Package
Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
---|---|---|---|---|---|---|---|
74ALVC573BQ | 74ALVC573BQ,115 (935273687115) |
Active | ALVC573 |
DHVQFN20 (SOT764-1) |
SOT764-1 | SOT764-1_115 | |
74ALVC573D | 74ALVC573D,118 (935269737118) |
Active | 74ALVC573D |
SO20 (SOT163-1) |
SOT163-1 |
WAVE_BG-BD-1
|
SOT163-1_118 |
74ALVC573PW | 74ALVC573PW,118 (935269736118) |
Active | ALVC573 |
TSSOP20 (SOT360-1) |
SOT360-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT360-1_118 |
Environmental information
Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
---|---|---|---|---|
74ALVC573BQ | 74ALVC573BQ,115 | 74ALVC573BQ | ||
74ALVC573D | 74ALVC573D,118 | 74ALVC573D | ||
74ALVC573PW | 74ALVC573PW,118 | 74ALVC573PW |
Documentation (14)
File name | Title | Type | Date |
---|---|---|---|
74ALVC573 | Octal D-type transparent latch; 3-state | Data sheet | 2023-07-11 |
SOT764-1 | 3D model for products with SOT764-1 package | Design support | 2019-10-03 |
SOT163-1 | 3D model for products with SOT163-1 package | Design support | 2020-01-22 |
SOT360-1 | 3D model for products with SOT360-1 package | Design support | 2020-01-22 |
alvc573 | alvc573 IBIS model | IBIS model | 2013-04-08 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
DHVQFN20_SOT764-1_mk | plastic, dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 2.5 mm x 4.5 mm x 0.85 mm body | Marcom graphics | 2017-01-28 |
TSSOP20_SOT360-1_mk | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
SOT764-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 4.5 mm x 2.5 mm x 1 mm body | Package information | 2022-06-21 |
SOT163-1 | plastic, small outline package; 20 leads; 1.27 mm pitch; 12.8 mm x 7.5 mm x 2.65 mm body | Package information | 2022-06-20 |
SOT360-1 | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.1 mm body | Package information | 2022-06-21 |
Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
Support
If you are in need of design/technical support, let us know and fill in the answer form we'll get back to you shortly.
Models
File name | Title | Type | Date |
---|---|---|---|
SOT764-1 | 3D model for products with SOT764-1 package | Design support | 2019-10-03 |
SOT163-1 | 3D model for products with SOT163-1 package | Design support | 2020-01-22 |
SOT360-1 | 3D model for products with SOT360-1 package | Design support | 2020-01-22 |
alvc573 | alvc573 IBIS model | IBIS model | 2013-04-08 |
Ordering, pricing & availability
Sample
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If you do not have a direct account with Nexperia our network of global and regional distributors is available and equipped to support you with Nexperia samples. Check out the list of official distributors.