74AXP4T245
Parametrics
Type number | VCC(A) (V) | VCC(B) (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | Nr of bits | Power dissipation considerations | Tamb (°C) | Package name | Category |
---|---|---|---|---|---|---|---|---|---|---|
74AXP4T245BQ | 0.9 - 5.5 | 0.9 - 5.5 | CMOS | ± 12 | 9 | 4 | ultra low | -40~125 | DHVQFN16 | Bi-directional | Direction controlled |
74AXP4T245PW | 0.9 - 5.5 | 0.9 - 5.5 | CMOS | ± 12 | 9 | 4 | ultra low | -40~125 | TSSOP16 | Bi-directional | Direction controlled |
Package
Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
---|---|---|---|---|---|---|---|
74AXP4T245BQ | 74AXP4T245BQX (935690704115) |
Active | P4T245 |
DHVQFN16 (SOT763-1) |
SOT763-1 | SOT763-1_115 | |
74AXP4T245PW | 74AXP4T245PWJ (935690703118) |
Active | XP4T245 |
TSSOP16 (SOT403-1) |
SOT403-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT403-1_118 |
Environmental information
Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
---|---|---|---|---|
74AXP4T245BQ | 74AXP4T245BQX | 74AXP4T245BQ | ||
74AXP4T245PW | 74AXP4T245PWJ | 74AXP4T245PW |
Documentation (11)
File name | Title | Type | Date |
---|---|---|---|
74AXP4T245 | 4-bit dual supply translating transceiver; 3-state | Data sheet | 2020-02-06 |
AN90029 | Pin FMEA for AXPnT family | Application note | 2021-07-13 |
SOT763-1 | 3D model for products with SOT763-1 package | Design support | 2019-10-03 |
SOT403-1 | 3D model for products with SOT403-1 package | Design support | 2020-01-22 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
DHVQFN16_SOT763-1_mk | plastic, dual in-line compatible thermal enhanced very thin quad flat package; 16 terminals; 0.5 mm pitch; 3.5 mm x 2.5 mm x 0.85 mm body | Marcom graphics | 2017-01-28 |
TSSOP16_SOT403-1_mk | plastic, thin shrink small outline package; 16 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
SOT763-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 16 terminals; 0.5 mm pitch; 3.5 mm x 2.5 mm x 1 mm body | Package information | 2023-05-11 |
SOT403-1 | plastic, thin shrink small outline package; 16 leads; 5 mm x 4.4 mm x 1.2 mm body | Package information | 2023-11-08 |
Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
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