74HC366-Q100; 74HCT366-Q100
Parametrics
Type number | VCC (V) | Logic switching levels | Output drive capability (mA) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Package name |
---|---|---|---|---|---|---|---|---|
74HC366D-Q100 | 2.0 - 6.0 | CMOS | ± 7.8 | 36 | 6 | low | -40~125 | SO16 |
74HC366PW-Q100 | 2.0 - 6.0 | CMOS | ± 7.8 | 36 | 6 | low | -40~125 | TSSOP16 |
74HCT366D-Q100 | 4.5 - 5.5 | TTL | ± 6 | 36 | 6 | low | -40~125 | SO16 |
74HCT366PW-Q100 | 4.5 - 5.5 | TTL | ± 6 | 36 | 6 | low | -40~125 | TSSOP16 |
Package
Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
---|---|---|---|---|---|---|---|
74HC366D-Q100 | 74HC366D-Q100,118 (935298932118) |
Active | 74HC366D |
SO16 (SOT109-1) |
SOT109-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
SOT109-1_118 |
74HC366PW-Q100 | 74HC366PW-Q100,118 (935298933118) |
Active | HC366 |
TSSOP16 (SOT403-1) |
SOT403-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT403-1_118 |
74HCT366D-Q100 | 74HCT366D-Q100,118 (935298934118) |
Active | 74HCT366D |
SO16 (SOT109-1) |
SOT109-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
SOT109-1_118 |
74HCT366PW-Q100 | 74HCT366PW-Q100,11 (935298935118) |
Active | HCT366 |
TSSOP16 (SOT403-1) |
SOT403-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT403-1_118 |
Environmental information
Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
---|---|---|---|---|
74HC366D-Q100 | 74HC366D-Q100,118 | 74HC366D-Q100 | ||
74HC366PW-Q100 | 74HC366PW-Q100,118 | 74HC366PW-Q100 | ||
74HCT366D-Q100 | 74HCT366D-Q100,118 | 74HCT366D-Q100 | ||
74HCT366PW-Q100 | 74HCT366PW-Q100,11 | 74HCT366PW-Q100 |
Documentation (16)
File name | Title | Type | Date |
---|---|---|---|
74HC_HCT366_Q100 | Hex buffer/line driver; 3-state; inverting | Data sheet | 2024-03-13 |
AN11044 | Pin FMEA 74HC/74HCT family | Application note | 2019-01-09 |
SOT109-1 | 3D model for products with SOT109-1 package | Design support | 2020-01-22 |
SOT403-1 | 3D model for products with SOT403-1 package | Design support | 2020-01-22 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
SO16_SOT109-1_mk | plastic, small outline package; 16 leads; 1.27 mm pitch; 9.9 mm x 3.9 mm x 1.35 mm body | Marcom graphics | 2017-01-28 |
TSSOP16_SOT403-1_mk | plastic, thin shrink small outline package; 16 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
SOT109-1 | plastic, small outline package; 16 leads; 1.27 mm pitch; 9.9 mm x 3.9 mm x 1.75 mm body | Package information | 2023-11-07 |
SOT403-1 | plastic, thin shrink small outline package; 16 leads; 5 mm x 4.4 mm x 1.2 mm body | Package information | 2023-11-08 |
SO-SOJ-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
hc | HC/HCT Spice model | SPICE model | 2022-02-17 |
Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
HCT_USER_GUIDE | HC/T User Guide | User manual | 1997-10-31 |
SO-SOJ-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
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