74ALVCH16374
Parametrics
| Type number | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | fmax (MHz) | Power dissipation considerations | Tamb (°C) | Package name |
|---|---|---|---|---|---|---|---|---|
| 74ALVCH16374DGG | 1.2 - 3.6 | TTL | ± 24 | 2.3 | 350 | low | -40~85 | TSSOP48 |
Package
| Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
|---|---|---|---|---|---|---|---|
| 74ALVCH16374DGG | 74ALVCH16374DGG:11 (935205130118) |
Active | ALVCH16374 |
TSSOP48 (SOT362-1) |
SOT362-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT362-1_118 |
All type numbers in the table below are discontinued.
| Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
|---|---|---|---|---|---|---|---|
| 74ALVCH16374DL | 74ALVCH16374DL,112 (935260444112) |
Obsolete | ALVCH16374 Standard Procedure Standard Procedure |
SSOP48 (SOT370-1) |
SOT370-1 |
SSOP-TSSOP-VSO-REFLOW
SSOP-TSSOP-VSO-WAVE |
Not available |
| 74ALVCH16374DL,118 (935260444118) |
Obsolete | ALVCH16374 Standard Procedure Standard Procedure | SOT370-1_118 |
Environmental information
| Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
|---|---|---|---|---|
| 74ALVCH16374DGG | 74ALVCH16374DGG:11 | 74ALVCH16374DGG |
|
|
All type numbers in the table below are discontinued.
| Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
|---|---|---|---|---|
| 74ALVCH16374DL | 74ALVCH16374DL,112 | 74ALVCH16374DL |
|
|
| 74ALVCH16374DL | 74ALVCH16374DL,118 | 74ALVCH16374DL |
|
|
Documentation (10)
| File name | Title | Type | Date |
|---|---|---|---|
| 74ALVCH16374 | 2.5 V/3.3 V 16-bit edge-triggered D-type flip-flop; 3-state | Data sheet | 2024-06-19 |
| SOT362-1 | 3D model for products with SOT362-1 package | Design support | 2020-01-22 |
| alvch16374 | alvch16374 IBIS model | IBIS model | 2013-04-08 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| TSSOP48_SOT362-1_mk | plastic, thin shrink small outline package; 48 leads; 0.5 mm pitch; 12.8 mm x 6.1 mm x 1.2 mm body | Marcom graphics | 2017-01-28 |
| SOT362-1 | plastic thin shrink small outline package; 48 leads; body width 6.1 mm | Package information | 2024-01-05 |
| SOT370-1 | plastic, shrink small outline package; 48 leads; 0.635 mm pitch; 15.9 mm x 7.5 mm x 2.8 mm body | Package information | 2020-04-21 |
| SSOP-TSSOP-VSO-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
| Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
Support
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Models
| File name | Title | Type | Date |
|---|---|---|---|
| SOT362-1 | 3D model for products with SOT362-1 package | Design support | 2020-01-22 |
| alvch16374 | alvch16374 IBIS model | IBIS model | 2013-04-08 |
Ordering, pricing & availability
Sample
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If you do not have a direct account with Nexperia our network of global and regional distributors is available and equipped to support you with Nexperia samples. Check out the list of official distributors.