Orderable parts
Type number | Orderable part number | Ordering code (12NC) | Package | Buy from distributors |
---|---|---|---|---|
PSMN1R7-30YL | PSMN1R7-30YL,115 | 934063068115 | SOT669 | Order product |
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Click here for more informationN-channel 30 V 1.7 mΩ logic level MOSFET in LFPAK
Logic level N-channel MOSFET in LFPAK package qualified to 175 °C. This product is designed and qualified for use in a wide range of industrial, communications and domestic equipment.
Advanced TrenchMOS provides low RDSon and low gate charge
High efficiency gains in switching power convertors
Improved mechanical and thermal characteristics
LFPAK provides maximum power density in a Power SO8 package
DC-to-DC converters
Lithium-ion battery protection
Load switching
Motor control
Server power supplies
Type number | Package version | Package name | Product status | Channel type | Nr of transistors | VDS [max] (V) | RDSon [max] @ VGS = 10 V (mΩ) | RDSon [max] @ VGS = 4.5 V; @25 C (mΩ) | Tj [max] (°C) | ID [max] (A) | QGD [typ] (nC) | QG(tot) [typ] @ VGS = 4.5 V (nC) | QG(tot) [typ] @ VGS = 10 V (nC) | Ptot [max] (W) | Qr [typ] (nC) | VGSth [typ] (V) | Automotive qualified | Ciss [typ] (pF) | Coss [typ] (pF) | Release date |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
PSMN1R7-30YL | SOT669 | LFPAK56; Power-SO8 | Production | N | 1 | 30 | 1.7 | 2.1 | 175 | 100 | 8.7 | 36.2 | 77.9 | 109 | 56 | 1.7 | N | 5057 | 1082 | 2011-01-27 |
Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
---|---|---|---|---|---|---|---|
PSMN1R7-30YL | PSMN1R7-30YL,115 (934063068115) |
Active | 1R730 |
LFPAK56; Power-SO8 (SOT669) |
SOT669 |
REFLOW_BG-BD-1
WAVE_BG-BD-1 |
SOT669_115 |
Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
---|---|---|---|---|
PSMN1R7-30YL | PSMN1R7-30YL,115 | PSMN1R7-30YL |
File name | Title | Type | Date |
---|---|---|---|
PSMN1R7-30YL | N-channel 30 V, 1.7 mΩ logic level MOSFET in LFPAK | Data sheet | 2018-04-02 |
AN10273 | Power MOSFET single-shot and repetitive avalanche ruggedness rating | Application note | 2022-06-20 |
AN10874_ZH | LFPAK MOSFET thermal design guide, Chinese version | Application note | 2020-04-30 |
AN11113_ZH | LFPAK MOSFET thermal design guide - Part 2 | Application note | 2020-04-30 |
AN11156 | Using Power MOSFET Zth Curves | Application note | 2021-01-04 |
AN11158 | Understanding power MOSFET data sheet parameters | Application note | 2020-07-06 |
AN11158_ZH | Understanding power MOSFET data sheet parameters | Application note | 2021-01-04 |
AN11160 | Designing RC Snubbers | Application note | 2024-10-21 |
AN11243 | Failure signature of Electrical Overstress on Power MOSFETs | Application note | 2017-12-21 |
AN11261 | RC Thermal Models | Application note | 2021-03-18 |
AN11599 | Using power MOSFETs in parallel | Application note | 2016-07-13 |
SOT669 | 3D model for products with SOT669 package | Design support | 2017-06-30 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
LFPAK56_POWER-SO8_SOT669_mk | plastic, single-ended surface-mounted package; 4 terminals; 4.9 mm x 4.45 mm x 1 mm body | Marcom graphics | 2017-01-28 |
SOT669 | plastic, single-ended surface-mounted package; 4 terminals | Package information | 2022-05-30 |
SOT669_115 | LFPAK56; Reel pack for SMD, 7"; Q1/T1 product orientation | Packing information | 2022-05-10 |
Reliability_information_t6_sot669 | Reliability qualification information | Quality document | 2022-10-13 |
T6_SOT669_PSMN1R7-30YL_Nexperia_Quality_document | PSMN1R7-30YL Quality document | Quality document | 2022-10-12 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
PSMN1R7-30YL | PSMN1R7-30YL SPICE model | SPICE model | 2010-03-16 |
PSMN1R7_30YL | PSMN1R7_30YL SPICE model | SPICE model | 2012-06-08 |
TN00008 | Power MOSFET frequently asked questions and answers | Technical note | 2024-08-09 |
PSMN1R7-30YL | PSMN1R7-30YL Thermal model | Thermal model | 2008-08-26 |
WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
If you are in need of design/technical support, let us know and fill in the answer form we'll get back to you shortly.
File name | Title | Type | Date |
---|---|---|---|
PSMN1R7-30YL | PSMN1R7-30YL SPICE model | SPICE model | 2010-03-16 |
PSMN1R7_30YL | PSMN1R7_30YL SPICE model | SPICE model | 2012-06-08 |
PSMN1R7-30YL | PSMN1R7-30YL Thermal model | Thermal model | 2008-08-26 |
SOT669 | 3D model for products with SOT669 package | Design support | 2017-06-30 |
Type number | Orderable part number | Ordering code (12NC) | Status | Packing | Packing Quantity | Buy online |
---|---|---|---|---|---|---|
PSMN1R7-30YL | PSMN1R7-30YL,115 | 934063068115 | Active | SOT669_115 | 1,500 | Order product |
As a Nexperia customer you can order samples via our sales organization.
If you do not have a direct account with Nexperia our network of global and regional distributors is available and equipped to support you with Nexperia samples. Check out the list of official distributors.
The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.